Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
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Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
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Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
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Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
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Guide to Switches for Your Application
Download this e-book to learn about the different types of switches available for pneumatic and hydraulic devices.
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Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
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New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
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New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
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Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...
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Fresh Air Intake Designed to Meet ASHRAE 62.2 standards
Alan Manufacturing has a long history of developing innovative solutions for HVAC applications. With over 1,000 product designs under our belt, we have gained a reputation as the go-to source for HVAC dampers, hardware, duct supports, zone control systems, and much more. Adding to this extensive list of achievements we now announce the release of our new line of Fresh Air Intake products. Designed to meet ASHRAE 62.2 standards, they are the most robust and high-performance product of their kind. See our video to learn more.
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