Thermal Interface Materials

Paste

Electrolube Filled Thermal Pastes: Reliably Applied Using VisctoTec Dosing Pumps

ElectrolubeÂ-  manufactures electro-chemical products for the electronics industry. These include thermal management products, compounds, coatings, lubricants and cleaning agents. With its expansive product range of formulated chemical products, Electrolube supplies manufacturers of electronic, industrial and domestic devices for a variety of industries, thus offering the ‘complete...

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Thermal Interface Materials optimize heatsink performance.
Coatings

Thermal Interface Materials optimize heatsink performance.

Available in thicknesses of 0.2, 0.3, and 0.45 mm, Sarcon® GAR Thin Films deliver high thermal conductivity of 3.0 W/m°K while exhibiting thermal resistance as low as .17°C in.Â-²/W. Glass fabric reinforced materials exert low force on components as they fill near-microscopic air gaps between heatsink and board-level heat sources. Supplied in rolls, pre-cut sheets, and...

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Custom-Fabricated Thermal Management Materials Save Time, Money
Adhesive Tapes

Custom-Fabricated Thermal Management Materials Save Time, Money

ROCHESTER, NY – Web Seal fabricates custom thermal management materials manufactured by Bergquist, Chomerics, Kerafol, 3M, MHW, and Chang Sung for a wide variety of industries, including automotive, communication, defense /aerospace, textiles, food processing, chemical industries, and medical instruments.Â-  With advances in electronics, thermal management is especially critical due to...

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Circuit Board Assembly Services

YINCAE at ECTC in Las Vegas in 2 weeks!!

ECTC is 2 weeks away! VISIT YINCAE BOOTH 506 June 1st to June 2nd Albany, NY – ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.Â-  YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and...

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Adhesives

ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd

ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...

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Solder

Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â-  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...

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Thermal Interface Thin Film improves heatsink cooling performance.
Miscellaneous Film

Thermal Interface Thin Film improves heatsink cooling performance.

Available toÂ- electronic packaging engineers, Sarcon® YR-c delivers thermal conductivity of 4.0 W/m°K with thermal resistance of .08°Cin.²/W. V-0 rated thin film thermal interface product, when placed between heat source and nearby heatsink, eliminates near-microscopic air gaps between components. Suited for applications...

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Thermal Interface Material combines soft touch, high performance.
Thermal Interface Materials

Thermal Interface Material combines soft touch, high performance.

Exhibiting thermal resistance down to 0.08°C in.Â-²/W @ 14 psi, Sarcon® PG80A low-compression force, putty-like thermal interface material suits applications that have delicate or wide-variation component heights and require 30%–90% material compression. Gap filler pad (13 W/m°K) gently conforms to component shapes and uneven surfaces to transfer...

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Low-Viscosity Gap Filling Material has high thermal conductivity.
Thermal Interface Materials

Low-Viscosity Gap Filling Material has high thermal conductivity.

Viscosity ofÂ- GAP FILLER 1400SL allows this 2-part, silicone-based, liquid gap filling material to flow in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer to 1.4 W/m-K. When cured, soft material allows absorption of CTE stresses and provides mechanical shock dampening for fragile assemblies. Product cures at room temperature...

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Liquid Gap Filler delivers 3.5 W/m-K thermal conductivity.
Fillers

Liquid Gap Filler delivers 3.5 W/m-K thermal conductivity.

To ensure reliable thermal interface for heat management, GAP FILLER 3500LV can fill tiny gaps and voids and offers zero shrinkage. This 2-part material, suited for use in applications that require optics to remain free of lens fogging,Â- addresses thermal requirements of next-generation product designs, produces minimal outgassing, and cures at room temperature. Accelerated curing can be...

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COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers