Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
Read More »
Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
Read More »
Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
Read More »
Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
Read More »
EMI Filters 101: Everything You Need To Know
In this eBook, we'll discuss everything you need to know about EMI filters, including their importance, regulatory requirements, and different types.
Read More »
Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
Read More »
Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
Read More »
Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
Read More »
New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
Read More »
New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
Read More »
Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...
Read More »
Don't Let Your Money Drain Down the Hole...Drill Steel with Euroboor
As a globally recognized manufacturer of industrial grade portable tools, Euroboor is at the forefront of drilling and cutting technology. Our reputation as an industry leader is built on robust products that fit a wide range of industrial cutting and drilling applications. See our video to learn more about all of our quality products.
Read More »
