Thermal Interface Materials

Adhesives

ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd

ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...

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Solder

Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â-  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...

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Thermal Interface Thin Film improves heatsink cooling performance.
Miscellaneous Film

Thermal Interface Thin Film improves heatsink cooling performance.

Available toÂ- electronic packaging engineers, Sarcon® YR-c delivers thermal conductivity of 4.0 W/m°K with thermal resistance of .08°Cin.²/W. V-0 rated thin film thermal interface product, when placed between heat source and nearby heatsink, eliminates near-microscopic air gaps between components. Suited for applications...

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Thermal Interface Material combines soft touch, high performance.
Thermal Interface Materials

Thermal Interface Material combines soft touch, high performance.

Exhibiting thermal resistance down to 0.08°C in.Â-²/W @ 14 psi, Sarcon® PG80A low-compression force, putty-like thermal interface material suits applications that have delicate or wide-variation component heights and require 30%–90% material compression. Gap filler pad (13 W/m°K) gently conforms to component shapes and uneven surfaces to transfer...

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Low-Viscosity Gap Filling Material has high thermal conductivity.
Thermal Interface Materials

Low-Viscosity Gap Filling Material has high thermal conductivity.

Viscosity ofÂ- GAP FILLER 1400SL allows this 2-part, silicone-based, liquid gap filling material to flow in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer to 1.4 W/m-K. When cured, soft material allows absorption of CTE stresses and provides mechanical shock dampening for fragile assemblies. Product cures at room temperature...

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Liquid Gap Filler delivers 3.5 W/m-K thermal conductivity.
Fillers

Liquid Gap Filler delivers 3.5 W/m-K thermal conductivity.

To ensure reliable thermal interface for heat management, GAP FILLER 3500LV can fill tiny gaps and voids and offers zero shrinkage. This 2-part material, suited for use in applications that require optics to remain free of lens fogging,Â- addresses thermal requirements of next-generation product designs, produces minimal outgassing, and cures at room temperature. Accelerated curing can be...

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Gap Filler exhibits low thermal resistance.
Thermal Interface Materials

Gap Filler exhibits low thermal resistance.

Available in sheets from 0.3–3.0 mm thick, Sarcon® GR80A can be die-cut to fit almost any application shape. Silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas while exhibiting very low pressure. When placed between heat source such as semiconductor and nearby heat sink, thermal interface material provides thermal...

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Adhesive Tapes

Bring The Heat! A Thermal Month with 3M Wrap-Up

This week officially wraps up our Thermal Management month with 3M. Throughout the last several weeks, we have focused on how important Thermal Management is in the development of various electronic devices that need to control the amount of heat that is being produced by them.Â-  As the demands on electrical components increase, 3M offers insulating and protecting products that are...

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Miscellaneous Pads

Material Highlight: 3M Thermally Conductive Interface Pads

3M Thermally Conductive Acrylic Interface Pads are used to transfer heat from a hot surface or device to a cooler surface region of the assembled design.Â-  The 3M Thermally Conductive Pads are available in acrylic, where a non-silicone base material is desired. The pads are designed in a variety of thermal conductivities and softness grades to provide excellent gap filling, low assembled...

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Adhesive Tapes

Material Highlight: 3M Thermally Conductive Adhesive Transfer Tape

3M Thermal Adhesive Tapes provide excellent long-term reliability, electrical insulation and flame retardant performance. 3M's highest mechanical strength, thermally conductive tapes feature excellent adhesion properties, improved surface wet out, and excellent shock performance. There are four types of 3M Thermally Conductive Adhesive Transfer Tapes including: 8805 (5 mil), 8810 (10 mil),...

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