Thermal Interface Materials

Don't Get Stressed Out
Thermal Interface Materials

Don't Get Stressed Out

Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...

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Don’t Get Stressed Out
Thermal Interface Materials

Don’t Get Stressed Out

Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...

Read More »

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