Henkel's Materials Innovations Honored at APEX
Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas. In the underfills category, Henkel won both an NPI Award and a Vision Award for its cornerbond underfill...
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Heat Reactive Transfer Adhesive bonds smart card chips.
Used for module embedding and lead frame lamination in smart card manufacturing, Thermofilm-® G185A co-polyamide film permanently bonds smart card chips and reinforces security for banking and telecommunication card applications. Film exhibits optimal bonding performance on PVC, ABS, and PVC/ABS blends and will destroy card if removed. It is approved for use on SIM, dual interface, contactless,...
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Heat Reactive Transfer Adhesive bonds smart card chips.
Used for module embedding and lead frame lamination in smart card manufacturing, ThermofilmÃ-® G185A co-polyamide film permanently bonds smart card chips and reinforces security for banking and telecommunication card applications. Film exhibits optimal bonding performance on PVC, ABS, and PVC/ABS blends and will destroy card if removed. It is approved for use on SIM, dual interface,...
Read More »Flomerics' MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project NANOPACK"
(February 26, 2008) - Flomerics' MicReD subsidiary will play a major role in the recently-announced European-funded NANOPACK" project (www.nanopack.org) which aims to address thermal barriers to continued performance increases in semiconductors and power electronics by developing new technologies and materials for low thermal resistance interfaces and electrical interconnects. Transistor...
Read More »Guide to Creating Color Cosmetics
This white paper provides an in-depth look on how to start a color cosmetic line.
Read More »Flomerics' MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project NANOPACK"
(February 26, 2008) - Flomerics' MicReD subsidiary will play a major role in the recently-announced European-funded NANOPACK" project (www.nanopack.org) which aims to address thermal barriers to continued performance increases in semiconductors and power electronics by developing new technologies and materials for low thermal resistance interfaces and electrical interconnects. Transistor...
Read More »Thermal Compound is qualified for semiconductor manufacturing.
AMD is First Semiconductor Manufacturer to Qualify TC-5121 for Use in Manufacturing MIDLAND, Mich., Dec. 11 / / -- Dow Corning Corporation's Electronics and Advanced Technologies group today announced the global availability of DOW CORNING(R) TC-5121 Thermally Conductive Compound - designed for mid-range electronic systems, such as desktop computers and graphic processing units. The new compound...
Read More »Thermal Compound is qualified for semiconductor manufacturing.
AMD is First Semiconductor Manufacturer to Qualify TC-5121 for Use in Manufacturing MIDLAND, Mich., Dec. 11 / / -- Dow Corning Corporation's Electronics and Advanced Technologies group today announced the global availability of DOW CORNING(R) TC-5121 Thermally Conductive Compound - designed for mid-range electronic systems, such as desktop computers and graphic processing units. The new compound...
Read More »Thermal Grease helps keep electronic chips cool.
Featuring solvent-free formulation, TC-5026 Thermally Conductive Compound carries heat away from PC microprocessor chips and other critical components. Able to thin out to very low bond lines, grease offers stability under adverse conditions such as thermal cycling, high humidity, and high-temperature aging. Product remains workable for spreading, screen printing, and dispensing, even after...
Read More »Thermal Grease helps keep electronic chips cool.
Featuring solvent-free formulation, TC-5026 Thermally Conductive Compound carries heat away from PC microprocessor chips and other critical components. Able to thin out to very low bond lines, grease offers stability under adverse conditions such as thermal cycling, high humidity, and high-temperature aging. Product remains workable for spreading, screen printing, and dispensing, even after...
Read More »Nanostructured Thin Film TEG(TM) Harvests and Converts Waste Heat into Electricity
Nextreme's miniature thin film TEG(TM) enables recycling of heat to electricity... Research Triangle Park, N.C. (August 15, 2007) - Nextreme has developed a miniature, thin film thermoelectric generator (TEG(TM)) that converts heat directly into electricity. Ideal for waste heat conversion applications, the solid state TEG delivers power generation densities (>3W/cm2) in excess of those achieved...
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Trotec Laser Offers Customizable Industrial Laser Marking Solutions for Any Application
Trotec's laser marking solutions provide your company with configurable workstations and intuitive, customizable software. Check out our video to learn more.
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