Elastomer Thermal Gap Filler requires no adhesive.
Compliant Elastomer Gap Filler Provides Electrical Isolation with High Tolerance Stack-Up St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new Tflex(TM) XS400 Series thermal gap filler. The Tflex(TM) XS400 Series...
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Thermal Transfer Compound offers high heat conductivity.
Fischer Elektronik have responded to market demand for a thermal transfer compound featuring high heat conductivity by developing a new graphite thermal transfer compound. This thermal transfer compound consists of a special graphite powder, which is integrated into an organic matrix. With a heat conductivity of ë = 10.5 W/mK, this thermal transfer compound is clearly better than those used up...
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Thermal Transfer Compound offers high heat conductivity.
Fischer Elektronik have responded to market demand for a thermal transfer compound featuring high heat conductivity by developing a new graphite thermal transfer compound. This thermal transfer compound consists of a special graphite powder, which is integrated into an organic matrix. With a heat conductivity of ë = 10.5 W/mK, this thermal transfer compound is clearly better than those used up...
Read More »BASF One of Eight Companies Honored by Society of Manufacturing Engineers
Micronal® phase-change materials named to list of Innovations That Could Change the Way You Manufacture" CHARLOTTE, NC, August 18, 2010 -- BASF's Micronal® phase-change material (PCM) technology was recently named by the Society of Manufacturing Engineers (SME), Dearborn, Michigan, as one of eight "Innovations That Could Change the Way You Manufacture." Micronal PCM is a microencapsulation...
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PCB Fabrication Notes Guide
The overall purpose of your fabrication notes is to enhance Design for Manufacturability for optimal PCB fabrication and assembly while maintaining applicable industry standards and regulations.
Read More »BASF One of Eight Companies Honored by Society of Manufacturing Engineers
Micronal-® phase-change materials named to list of Innovations That Could Change the Way You Manufacture" CHARLOTTE, NC, August 18, 2010 -- BASF's Micronal® phase-change material (PCM) technology was recently named by the Society of Manufacturing Engineers (SME), Dearborn, Michigan, as one of eight "Innovations That Could Change the Way You Manufacture." Micronal PCM is a microencapsulation...
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Silicone-Free Thermal Interface Pads have light tack adhesive.
Keratherm U 90 thermal interface materials are ceramic-filled polyurethane films with thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 Kin-²/W, available in thicknesses of 0.125, 0.225, and 0.325 mm. Offered in 0.175 and 0.325 mm thicknesses, Keratherm U 80 materials provide 1.8 W/mK conductivity and 0.11 Kin²/W impedance. Both include light tack adhesive to keep them in place...
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Silicone-Free Thermal Interface Pads have light tack adhesive.
Keratherm U 90 thermal interface materials are ceramic-filled polyurethane films with thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 KinÃ-²/W, available in thicknesses of 0.125, 0.225, and 0.325 mm. Offered in 0.175 and 0.325 mm thicknesses, Keratherm U 80 materials provide 1.8 W/mK conductivity and 0.11 Kinò/W impedance. Both include light tack adhesive to keep them in...
Read More »Phase Change Material provides natural tack.
Hi-Flow®330P assures easy dispensing and excellent thermal performance for high power applications. CHANHASSEN, MN - The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials, Hi-Flow 330P. Hi-Flow 330P has excellent handling characteristics. With a polyimide film reinforcement, its top side is dry to the touch and its bottom side has a...
Read More »Phase Change Material provides natural tack.
Hi-Flow-®330P assures easy dispensing and excellent thermal performance for high power applications. CHANHASSEN, MN - The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials, Hi-Flow 330P. Hi-Flow 330P has excellent handling characteristics. With a polyimide film reinforcement, its top side is dry to the touch and its bottom side has a...
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Thermal Gap Fillers optimize heat transfer.
Supplied in 8.3 x 11.7 in. sheets or standard/custom die cut shapes, TP-S30 thermal interface pads are soft and compliant for facilitated compression and filling of air gaps between mounting surfaces to optimize heat transfer. They provide 3.0 W/mK of thermal conductivity between hot components and heat sinks in range of applications. Standard materials have Shore 00 hardness of 45, and standard...
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3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership
At 3Sixty Mission Critical, we specialize in maintaining the performance and uptime of our customer's mission-critical applications. Our services are comprehensive and designed to take on the entire burden of maintenance. Our "UPS as a service" is just another example of how we develop out of the box solutions to help our customers operate more efficiently; see our video to earn more.
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