Laird Technologies to Attend Strategies in Light 2013
Company to Showcase Thermal Interface Materials St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will attend Strategies in Light 2013. The event will take place at the Santa Clara Convention Center in Santa Clara, California,...
Read More »Thermal Gap Fillers feature silicone-free design.
Offered in variety of thicknesses to suit virtually any need, Tflex™ SF800 features thermal conductivity of 7.9 W/mK, while Tflex™ SF200 offers thermal conductivity of 1.8 W/mK or 2.0 W/mK, depending on thickness. Silicone-free gap pads are naturally tacky on both sides and require no additional adhesive coating. In addition, SF200 is available with differential tack for assembly and rework....
Read More »Thermal Gap Fillers feature silicone-free design.
Offered in variety of thicknesses to suit virtually any need, Tflex™ SF800 features thermal conductivity of 7.9 W/mK, while Tflex™ SF200 offers thermal conductivity of 1.8 W/mK or 2.0 W/mK, depending on thickness. Silicone-free gap pads are naturally tacky on both sides and require no additional adhesive coating. In addition, SF200 is available with differential tack for assembly and rework....
Read More »Electrolube Showcases New Silicone Resins, Conformal Coatings, and Non-Silicone Thermal Products at NEPCON South China
Electrolube, the global manufacturer at the forefront of chemicals technology for the electronics, automotive and industrial manufacturing industries, will showcase its newest SC Silicone range and non-silicone thermal products to the Chinese market at NEPCON South China 2012, taking place between the 28th to the 30th August at the Shenzhen Convention & Exhibition Centre. The new SC range of...
Read More »A Guide to the Non-Metallic Precision Stamping Process
This white paper provides a guide to the non-Metallic precision stamping process.
Read More »Electrolube Showcases New Silicone Resins, Conformal Coatings, and Non-Silicone Thermal Products at NEPCON South China
Electrolube, the global manufacturer at the forefront of chemicals technology for the electronics, automotive and industrial manufacturing industries, will showcase its newest SC Silicone range and non-silicone thermal products to the Chinese market at NEPCON South China 2012, taking place between the 28th to the 30th August at the Shenzhen Convention & Exhibition Centre. The new SC range of...
Read More »SABIC Demonstrates High-Tech Materials Solutions for Top Healthcare Trends in Patient Safety and Device Portability at New MD&M Brazil
SÃO PAULO, Brazil - Major healthcare industry trends, such as improving patient safety and creating smaller, more accessible devices, are receiving strong support from SABIC's Innovative Plastics business, which is spotlighting an array of advanced thermoplastic resins from its broad product portfolio here at the debut of MD&M Brazil 2012 (booth #709). Among the featured applications promoting...
Read More »SABIC Demonstrates High-Tech Materials Solutions for Top Healthcare Trends in Patient Safety and Device Portability at New MD&M Brazil
SÃÆ'O PAULO, Brazil - Major healthcare industry trends, such as improving patient safety and creating smaller, more accessible devices, are receiving strong support from SABIC's Innovative Plastics business, which is spotlighting an array of advanced thermoplastic resins from its broad product portfolio here at the debut of MD&M Brazil 2012 (booth #709). Among the featured applications...
Read More »Indium Corporation's Heat-Spring® Enhances Green Revolution's CarnotJet(TM) Server Cooling System
Indium Corporation's Heat-Spring® compressible soft metal thermal interface material is now being used in Green Revolution's CarnotJet(TM) liquid server cooling system. Green Revolution's CarnotJet(TM) System is one of the most powerful and efficient computer server cooling systems in the world. With over 100kW of cooling potential per rack, it can reduce a data center's total energy use by 50%....
Read More »Indium Corporation's Heat-Spring-® Enhances Green Revolution's CarnotJet(TM) Server Cooling System
Indium Corporation's Heat-Spring-® compressible soft metal thermal interface material is now being used in Green Revolution's CarnotJet(TM) liquid server cooling system. Green Revolution's CarnotJet(TM) System is one of the most powerful and efficient computer server cooling systems in the world. With over 100kW of cooling potential per rack, it can reduce a data center's total energy use by...
Read More »Henkel Develops Materials Innovations for High Power Electronics
Henkel develops materials innovations for high power electronics Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high...
Read More »How SpinSelect Can Save You Time and Money
Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.
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