Thermal Interface Materials

Silicon

Dispensable Thermal Pads target LED lighting applications.

With Dispensable Thermal Pads, LED luminaire manufacturers can print layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes while ensuring optimal thermal management. TC-4015 and TC-4016 offer thermal conductivity of 1.5 W/mK, while TC-4025 and TC-4026 offer thermal conductivity of 2.5 W/mK. Incorporating glass beads, TC-4016 and TC-4026 enable...

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Silicon

Dispensable Thermal Pads target LED lighting applications.

With Dispensable Thermal Pads, LED luminaire manufacturers can print layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes while ensuring optimal thermal management. TC-4015 and TC-4016 offer thermal conductivity of 1.5 W/mK, while TC-4025 and TC-4026 offer thermal conductivity of 2.5 W/mK. Incorporating glass beads, TC-4016 and TC-4026 enable...

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Testing Services

TIM Characterization Tools come in various sizes, package types.

Thermal Interface Material (TIM) characterization tools comprise Thermal Test Chips (TTCs) in sizes from 2.5–12.8 mm-² mounted on various packages, including BGA, QFN, and DIP. These tools, which include TTV-1100/1200/1500/1800/3000/3100 Series, can also be used to simulate heat sources for validation of thermal simulation, quantify thermal management performance, and establish...

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Testing Services

TIM Characterization Tools come in various sizes, package types.

Thermal Interface Material (TIM) characterization tools comprise Thermal Test Chips (TTCs) in sizes from 2.5–12.8 mmÂ-² mounted on various packages, including BGA, QFN, and DIP. These tools, which include TTV-1100/1200/1500/1800/3000/3100 Series, can also be used to simulate heat sources for validation of thermal simulation, quantify thermal management performance, and establish...

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MacDermid's XtraForm Takes FIM to Another Level
Miscellaneous Film

MacDermid's XtraForm Takes FIM to Another Level

MacDermid Autotype's XtraForm™ has provided the perfect film for moldings on deep sea diving equipment for Italian manufacturer Mares. The success of this film insert molding solution underlines the excellent durability of XtraForm even in extreme conditions. Mares is a worldwide leader in the manufacturing and distribution of high-tech diving equipment, and its local moulding supplier, Mold &...

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MacDermid's XtraForm Takes FIM to Another Level
Miscellaneous Film

MacDermid's XtraForm Takes FIM to Another Level

MacDermid Autotype's XtraForm™ has provided the perfect film for moldings on deep sea diving equipment for Italian manufacturer Mares. The success of this film insert molding solution underlines the excellent durability of XtraForm even in extreme conditions. Mares is a worldwide leader in the manufacturing and distribution of high-tech diving equipment, and its local moulding supplier, Mold &...

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New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance
Modules

New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance

New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today's power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded over the long term. A...

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New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance
Modules

New Type of Paste with Enhanced Thermal Conductivity for Modules - TIM Allows Higher Power Density for Same Ageing Resistance

New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today's power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded over the long term. A...

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Laird Technologies to Attend Strategies in Light 2013
Circuit Board Assembly Services

Laird Technologies to Attend Strategies in Light 2013

Company to Showcase Thermal Interface Materials St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will attend Strategies in Light 2013. The event will take place at the Santa Clara Convention Center in Santa Clara, California,...

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Sponsored

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