Thermal Interface Materials

Miscellaneous Film

Thermal Film is 1.6 mil thick.

Series TF-160 tear-resistant ultra-thin film is opaque white and produces black image that withstands moderate exposure to moisture, light, and heat. It suits direct thermal applications including healthcare identification, pharmaceutical labeling, frozen food and meat packing, fruit labeling, durable receipts, event passes, sporting licenses, airline bag tags, and temporary phone cards.

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Thermal Interface Materials

Thermal Interface Material requires no heating.

Reworkable Loctite® PowerstrateXtreme(TM), suited for use between heat sink and heat dissipating components, is supplied as free-standing film between 2 release liners. Compound flows at phase change temperature and conforms to surface features of heat sink and component. Upon flow, air is expelled from interface, thermal impedance is reduced, and product performs as thermal transfer...

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Thermosetting Film suits bonding, gasketing, and laminating.
Miscellaneous Film

Thermosetting Film suits bonding, gasketing, and laminating.

ThermoFilm® H153U, unsupported nitrile phenolic transfer film, is resistant to solvents, plasticizers, and heat when cured. Adhesive film is useful for temperature-sensitive substrates and provides bond strength that is considered to be structural for various applications. Supplied on 60 lb kraft release liner, it is suitable for nameplate mounting, gasketing, bonding dissimilar metals, and...

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Thermal Interface Materials

Thermal Interface Pads offer low thermal resistance.

SARCON® SF-Nd Phase Change Thermal Interface Pads have thermal conductivity of 2.0 W/m-K and thermal resistance of only 0.015°C inchÂ-²/W, at 85 psi. When junction temperature reaches 60°C, phase change material changes from solid state and begins to flow, filling all micro-pores of component and heat sink. Wetting action removes all pockets of air, providing best possible...

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Thermal Gap Filler Pads offer elasticity and consistency.
Miscellaneous Pads

Thermal Gap Filler Pads offer elasticity and consistency.

SARCON® XR-e and XR-j offer thermal conductivity of 11 and 14 watt/m-K, respectively, which produces thermal resistance of 0.11 to 0.14 inÂ-²/W for XR-e and 0.09 to 0.12 in²/W for XR-j. Both pads offer flame retardant specifications satisfactory to UL94 V-0 class. Made from silicone compound, flexible pads conform to various design considerations and multiple component heights....

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Phase-Change Material simplifies heat sink removal.
Thermal Interface Materials

Phase-Change Material simplifies heat sink removal.

Thermflow T766 provides low thermal resistance interface path between hot components and heat sinks, allowing easy removal of sinks for rework operations. Foil layer lets heat sinks be removed without force and without leaving residue. Material consists of tacky, electrically non-conductive phase-change film on one side of highly conformable metal foil. Film attaches to heat sinks or spreaders...

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