Thermal Interface Materials

Miscellaneous Compounds

Thermally Conductive Compound resists pump-out.

Developed for use with Intel® Core®2 Extreme mobile processor QX9300, TC-5688 non-curing thermal grease offers low thermal resistance of 0.05°C-cmÂ-²/W and thermal conductivity of 5.67 W/mK. Product performs in real-world applications involving non-uniform substrates and varying bond line thicknesses. TC-5688 is also suitable for non-computing areas including power,...

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Thermal Interface Materials

Soft Gap Filler suits thermal interface applications.

T-flex(TM) 700, with 5.0 W/mK thermal conductivity and shore OO hardness value of 50, exhibits high compliancy that accommodates applications with high tolerance stack-up and low mechanical stress on components. Available in standard sheets or die cut parts that can be customized, soft gap filler has 0.040-0.200 in. thickness range in 0.010 in. increments. RoHS compliant product targets...

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Thermal Management Materials

Henkel's Materials Innovations Honored at APEX

Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas. In the underfills category, Henkel won both an NPI Award and a Vision Award for its cornerbond underfill...

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Heat Reactive Transfer Adhesive bonds smart card chips.
Thermal Interface Materials

Heat Reactive Transfer Adhesive bonds smart card chips.

Used for module embedding and lead frame lamination in smart card manufacturing, Thermofilm® G185A co-polyamide film permanently bonds smart card chips and reinforces security for banking and telecommunication card applications. Film exhibits optimal bonding performance on PVC, ABS, and PVC/ABS blends and will destroy card if removed. It is approved for use on SIM, dual interface,...

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Thermal Interface Materials

Flomerics' MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project "NANOPACK"

(February 26, 2008) - Flomerics' MicReD subsidiary will play a major role in the recently-announced European-funded NANOPACK" project (www.nanopack.org) which aims to address thermal barriers to continued performance increases in semiconductors and power electronics by developing new technologies and materials for low thermal resistance interfaces and electrical interconnects. Transistor...

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Miscellaneous Compounds

Thermal Compound is qualified for semiconductor manufacturing.

DOW CORNING® TC-5121 Thermally Conductive Compound combines high-performance silicon polymers with small heat-conducting filler particles to reduce scratches on heat sink lids. It offers high level of thermal conductivity at 2.5 W/mK and low level of thermal resistance at 0.1°C cm2/W. Designed for mid-range electronic systems, such as desktop computers and GPUs, compound carries heat...

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Thermal Interface Materials

Thermal Grease helps keep electronic chips cool.

Featuring solvent-free formulation, TC-5026 Thermally Conductive Compound carries heat away from PC microprocessor chips and other critical components. Able to thin out to very low bond lines, grease offers stability under adverse conditions such as thermal cycling, high humidity, and high-temperature aging. Product remains workable for spreading, screen printing, and dispensing, even after...

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Electrical Power Generators

Nanostructured Thin Film TEG(TM) Harvests and Converts Waste Heat into Electricity

Nextreme's miniature thin film TEG(TM) enables recycling of heat to electricity... Research Triangle Park, N.C. (August 15, 2007) - Nextreme has developed a miniature, thin film thermoelectric generator (TEG(TM)) that converts heat directly into electricity. Ideal for waste heat conversion applications, the solid state TEG delivers power generation densities (>3W/cm2) in excess of those achieved...

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Thermal Interface Pad meets UL 94V-0 flameclass requirements.
Thermal Interface Materials

Thermal Interface Pad meets UL 94V-0 flameclass requirements.

Designed for transferring heat from ICs and other components to their heat sinks, Keratherm 86/82 is thermally conductive, electrically isolating silicone film with reinforcing fiberglass layer for tear and cut-through resistance. It features thermal impedance of 0.05 W/mK, thermal conductivity of 6.5 W/mK, and tensile strength of 20 N/mmÂ-². Offered in wide range of standard or custom...

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Thermal Interface Materials

Soft Gap-Filler Materials provide thermal management.

Suited for electronic devices, THERM-A-GAP(TM) 569 and 579 come in pre-formed thicknesses from 0.020-0.2 in. as well as custom thicknesses. With thermal conductivity of 3 W/mK, RoHS-compliant materials are rated UL-V0 for flammability and pass NASA outgassing. They are available on aluminum foil or clean-break glass fiber carrier. Typical applications include desktop and laptop computers,...

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