Thermal Interface Materials

Shielding

Laird Technologies to Attend Electronica 2010 Trade Show

Company to Showcase Entire Product Portfolio and Hold Press Conference St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the electronica 2010 trade show. The trade show will be held at the New Munich Trade Fair...

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Instrument Displays

Laird Technologies' Thermal Management Expert to Present at AMD Technical Forum & Exhibition 2010

Presentation to Focus on High-Performance Thermal Interface Materials Solutions for Flat Panel Display Cooling St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced that one of its subject matter experts, Laird Technologies' Product...

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Thermal Interface Materials

Elastomer Thermal Gap Filler requires no adhesive.

Available in 0.020-0.200 in. thicknesses in 0.010 in. increments, Tflex(TM) XS400 Series RoHS-compliant thermal pad provides moderate thermal performance with thermal conductivity of 2.0 W/mK. Soft interface pad conforms with minimal pressure, and its design minimizes thermal resistance as well as mating part stress. Due to TG (Tgard(TM)) liner, it is electrically insulating, stable from -40 to...

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Thermal Transfer Compound offers high heat conductivity.
Graphite

Thermal Transfer Compound offers high heat conductivity.

Consisting of special graphite powder that is integrated into organic matrix, WLPG Graphite Thermal Transfer Compound features heat conductivity of λ = 10.5 W/mK. Product is free from silicone and synthetic oils or substances, and is electrically conductive and usable at temperatures from -40 to +320°C. Compound is supplied in plastic syringes containing 2, 5, 10, or 20 ml.

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Distillation 101: A Guide to Distillation and Separation Technologies
Sponsored

Distillation 101: A Guide to Distillation and Separation Technologies

Distillation is a separation unit operation that involves multiple countercurrent-stage steps, separating two or more volatile components. This results in the contact of liquid and vapor most generally in counterflow. Distillation 101: A Guide to Distillation and Separation Technologies provides an in-depth look at everything you need to know about distillation, including: Design procedures Equipment components Applications

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Thermal Interface Materials

BASF One of Eight Companies Honored by Society of Manufacturing Engineers

Micronal® phase-change materials named to list of "Innovations That Could Change the Way You Manufacture" CHARLOTTE, NC, August 18, 2010 -- BASF's Micronal® phase-change material (PCM) technology was recently named by the Society of Manufacturing Engineers (SME), Dearborn, Michigan, as one of eight "Innovations That Could Change the Way You Manufacture." Micronal PCM is a microencapsulation...

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Silicone-Free Thermal Interface Pads have light tack adhesive.
Miscellaneous Film

Silicone-Free Thermal Interface Pads have light tack adhesive.

Keratherm U 90 thermal interface materials are ceramic-filled polyurethane films with thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 KinÂ-²/W, available in thicknesses of 0.125, 0.225, and 0.325 mm. Offered in 0.175 and 0.325 mm thicknesses, Keratherm U 80 materials provide 1.8 W/mK conductivity and 0.11 Kin²/W impedance. Both include light tack adhesive to keep them...

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Thermal Interface Materials

Phase Change Material provides natural tack.

Featuring thermal impedance of 0.17°C-inÂ-²/W at 50 psi, Hi-Flow® 330P is suited for use between high-power electrical device requiring electrical isolation and its heat sink. With polyimide film reinforcement, top side is dry and bottom side has natural tack. Material is available in standard roll size of 11 in. by 250 ft and comes in thicknesses of 0.0045, 0.0050, and 0.0055...

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Thermal Gap Fillers optimize heat transfer.
Miscellaneous Agents

Thermal Gap Fillers optimize heat transfer.

Supplied in 8.3 x 11.7 in. sheets or standard/custom die cut shapes, TP-S30 thermal interface pads are soft and compliant for facilitated compression and filling of air gaps between mounting surfaces to optimize heat transfer. They provide 3.0 W/mK of thermal conductivity between hot components and heat sinks in range of applications. Standard materials have Shore 00 hardness of 45, and standard...

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Thermal Interface Materials

Indium Corporation's Heat-Spring® Wins Innova Award for Best Technology

Indium Corporation has won the Innova Award for Best Technology for its Heat-Spring® metallic thermal interface material (TIM). Heat-Spring is a clean, high-performance thermal solution for the increasing demands of high brightness LEDs. It is a compressible metal foil with proven performance in such demanding environments as electronics, aerospace, and power devices. The compressible TIM...

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Fabrico Materials Keep LEDs Cool
Miscellaneous Fabrics and Cloths

Fabrico Materials Keep LEDs Cool

Kennesaw, GA USA - Fabrico, the leader in design and manufacturing services for flexible materials, offers a range of converted thermal management materials for LED applications. These materials, usually consisting of adhesive-backed die-cut parts, act in consort with heat sinks to dissipate unwanted heat to ensure proper LED performance. Fabrico engineers work closely with customers to determine...

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