Thermal Interface Materials

Thermal Compound supports form-in-place gap filling.
Miscellaneous Compounds

Thermal Compound supports form-in-place gap filling.

Carteret, NJ- – SARCON® SPG-50A from Fujipoly® is among the industry's highest performance form-in-place gap filler compounds. The 5.0 W/m°K silicone based material is a great option for electronic devices that have delicate components or ultra-low compression force requirements. The form stable SPG-50A material fills large gaps around fragile circuit board solder points without...

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ZKW Group and DSM Develop New Light Weight LED Lighting Module for Audi Q7
Lights

ZKW Group and DSM Develop New Light Weight LED Lighting Module for Audi Q7

Royal DSM, the global Life Sciences and Material Sciences company, announces the use of Arnite® XL-T in the new Audi Q7 for automotive headlight applications that can resist extreme thermal loads. Headlights are a key distinguishing feature for a car's identity and currently LED lighting, with its excellent performance characteristics, is the cutting edge of automotive headlamp design. They are...

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ZKW Group and DSM Develop New Light Weight LED Lighting Module for Audi Q7
Lights

ZKW Group and DSM Develop New Light Weight LED Lighting Module for Audi Q7

Royal DSM, the global Life Sciences and Material Sciences company, announces the use of Arnite® XL-T in the new Audi Q7 for automotive headlight applications that can resist extreme thermal loads. Headlights are a key distinguishing feature for a car's identity and currently LED lighting, with its excellent performance characteristics, is the cutting edge of automotive headlamp design. They are...

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Cooling for LEDs
Thermal Interface Materials

Cooling for LEDs

Cooling for LEDs  Carteret, NJ — LED lighting has made a profound impact on the functionality and appearance of millions of consumer and commercial products. One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. If it is not managed correctly, this can severely limit the efficiency, output and useful...

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Cooling for LEDs
Thermal Interface Materials

Cooling for LEDs

Cooling for LEDs-  Carteret, NJ — LED lighting has made a profound impact on the functionality and appearance of millions of consumer and commercial products. One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. If it is not managed correctly, this can severely limit the efficiency, output and useful...

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Thermal Interface Material offers EMI absorption.
Thermal Interface Materials

Thermal Interface Material offers EMI absorption.

With thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1 GHz, GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in flexible, gap filling product designed to exhibit exceptionally low stress on solder joints. Thermal conductivity is optimized by material’s natural tack on one side, which eliminates requirement for any...

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Thermal Interface Material offers EMI absorption.
Thermal Interface Materials

Thermal Interface Material offers EMI absorption.

With thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1 GHz, GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in flexible, gap filling product designed to exhibit exceptionally low stress on solder joints. Thermal conductivity is optimized by material’s natural tack on one side, which eliminates requirement for any...

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Thermal Interface Materials optimize electronics' design.
Thermal Interface Materials

Thermal Interface Materials optimize electronics' design.

Formulated to support application requirements, Aavid SuperThermal™ offers high thermal conductivity up to 13.2 W/mK. Aavid SoftFlex™ includes 5 materials varying in elasticity, conductivity, cushioning ability, and compliancy. Softness and compressibility makes product suitable for decreasing board strain and for applications with shock or vibration. Aavid WaveBlocker™ gap filler,...

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Thermal Interface Materials optimize electronics' design.
Thermal Interface Materials

Thermal Interface Materials optimize electronics' design.

Formulated to support application requirements, Aavid SuperThermal™ offers high thermal conductivity up to 13.2 W/mK. Aavid SoftFlex™ includes 5 materials varying in elasticity, conductivity, cushioning ability, and compliancy. Softness and compressibility makes product suitable for decreasing board strain and for applications with shock or vibration. Aavid WaveBlocker™ gap filler,...

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Low-Profile Heatsinks enhance space-constrained designs.
Heat Sinks

Low-Profile Heatsinks enhance space-constrained designs.

Unique microporous structure maximizes surface area & enables more effective heat dissipation in space constrained designs Versarien (VRS.L), the advanced engineering material group, has introduced a series of next generation thermal management solutions optimized specifically for deployment in modern, streamlined, high density electronic designs. Its new low profile heatsinks utilize...

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