Surface Mount Components

PCB Mounted RFID Tag Solution from Murata and Cogiscan Wins NPI Award

Murata’s MAGICSTRAPÂ-® Integrated with Cogiscan's Track and Trace System Claims Labeling Equipment Category Hoofddorp, Netherlands: Murata's innovative RFID tag - MAGICSTRAPÂ-® - integrated with Cogiscan's TTC Middleware solution has won the 2013 New Product Introduction (NPI) Award from Circuits Assembly in the labelling equipment category. Murata's MAGICSTRAPÂ-® series is the...

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Wideband SMT Bias Tee covers wide frequency range.

Wideband SMT Bias Tee covers wide frequency range.

Measuring 3.8 x 3.8 mm, TCBT-14+ wideband Bias-Tee enables engineers to design with DC current up to 200 mA, insertion loss of less than 1 dB, and VSWR of 1.1:1. It covers frequencies from 10 MHz to 10 GHz without resonances typically observed over such a range. Suitable for automated pick and place operation, surface-mount product is designed to handle 1 W of RF power.

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Low Profile LED Package provides 130-

Low Profile LED Package provides 130-

Designed for high current drive, surface mount Model OVSPRGBCR4 is composed of red, green, and blue LED with water clear lenses mounted on top of devices. Each color can be independently controlled, as well as programmed for color mixing. Typical luminous flux for red, green, and blue LEDs is 21l m, 32l m, and 7.5l m, with typical on-axis intensity of 7 cd, 11 cd, and 2.8 cd, respectively....

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SMT LED Modules suit handheld appliance applications.

SMT LED Modules suit handheld appliance applications.

Available in 5 packaged module styles, T-Flash(TM) and Mega Flash(TM) Series feature lighting intensity ranges from 3,000-24,000 mcd, peak forward currents from 20 mA to 1 A, and power dissipation to 600 mW. Designs include heat sink-based reflector modules with footprints from 2.30 x 3.30 mm to 5.00 mmÂ-² and height of 1.50 mm. Compatible with wave and IR reflow soldering processes, LEDs...

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Cellular Surface Mounters feature compact design.

Suited for handling 0402 chips, SI-F130 is equipped planetary head and incorporates overlap mounting process that achieves placement tact time of 0.139 sec. It also features PCB loading/unloading system. Fine-pitch SI-F209 uses flying vision and nozzle changing systems in addition to ejector-aided PCB loading/unloading system with recognition technology. Designed for electronic chip mounting,...

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