Surface Mount Components

KEMET's KONNEKT Technology uses transient liquid phase sintering.

KEMET's KONNEKT Technology uses transient liquid phase sintering.

KONNEKT Technology enhances power densities by integrating multiple components into single surface mountable package. Konnekt when implemented on ultra-stable U2J dielectric provides low-loss, low-inductance package that can operate on hundreds of kilohertz range. Unit developed on this technology can be mounted to PCBs through reflow processes and technology is compliant to ROHS standards.

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YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter

YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter

San Diego, California, USA – Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH. The award, sponsored by UP Media/Circuits Assembly magazine, was presented on Tuesday, February 17, 2017 at the...

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Vishay Intertechnology at Electronica 2016 Nov. 8-11 Munich, Germany Hall A5 Booth 141-142, Hall A6 Booth A11-A13

New Products on Display at electronica 2016 vPolyTan™ Multi-Anode Solid Tantalum Chip Capacitors Increase Volumetric Efficiency to Lower Component Counts Combining polymer tantalum technology with Vishay's patented multi-array packaging (MAP), the T59 series offers up to 25 % better volumetric efficiency than similar devices, which allows for the industry's highest capacitance density. For...

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Modular Surface Mounter delivers placement rates to 200,000 CPH.

Modular Surface Mounter delivers placement rates to 200,000 CPH.

Supporting flexible and versatile production formats for OEMs and contract assemblers, Z:TA-R / YSM40R features- 1 m wide compact platform,- 4-beam layout, and multi-nozzle rotary head. High-speed side view camera checks status of components in real-time immediately after pickup as well as before and after mounting. Compatible with components down to 0201 metric (0.25 x 0.125 mm), system uses...

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Samtec to Present Technical Papers and Silicon-to-Silicon Product Demonstrations at DesignCon 2016

Samtec, Inc. will participate in the DesignCon 2016 conference and exhibition, January 19 - 21 at the Santa Clara Convention Center. Samtec will be featuring Silicon-to-Silicon product demonstrations, three 40-minute technical paper sessions, one 75-minute panel discussion and one 3-hour tutorial. The Silicon-to-Silicon product demonstration will include built-in pattern generation for bit rate,...

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Laser Direct Structuring (LDS) Pioneer A-Laser to Showcase MID Advances At BIOMEDevice San Jose

Laser Direct Structuring (LDS) Pioneer A-Laser to Showcase MID Advances At BIOMEDevice San Jose

At the upcoming BIOME Device event, set to take place December 2nd and 3rd in San Jose, CA,-  A-Laser, will highlight how its unique capabilities of Laser Direct Structuring (LDS) of Molded Interconnect Devices (MID), are lending new design and functionality freedom to the MID market.- - -  From booth 219, A-Laser technology experts look forward to discussing LDS and its MID-enabling...

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Universal to Demonstrate Fuzion, Share APL Expertise at SMTA International

Universal to Demonstrate Fuzion, Share APL Expertise at SMTA International

Leading-edge technologies and expertise combine to deliver powerful solutions and maximum value. Universal Instruments will be exhibiting on Booth #306 at the SMTA International 2015 Exhibition in Rosemont, IL, on September 29–30. The company will feature its flagship Fuzion-® surface mount platform on the booth, demonstrating the versatile performance of its Fuzion2-60™. Experts from...

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In House MMIC Development Suit

Elbit Systems EW and SIGINT – Elisra receives much attention at The- IMS2015 in Phoenix. MMIC-  Devices: • Passive and Active 0.15um PHEMT GaAs MMIC's DC – 50 GHz • Passive components printed on hard substrates • Multi Function Integrated Circuits • Multi Layer Technology • In House On-Wafer (Probe Station) Testing • Multi Layer Buried Components

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Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at OFC 2015

Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products MALVERN, Pa.- – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2015 Optical Fiber Communications Conference and Exhibition (OFC 2015), taking place March 22-26 at the Los Angeles...

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3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership
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3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership

At 3Sixty Mission Critical, we specialize in maintaining the performance and uptime of our customer's mission-critical applications. Our services are comprehensive and designed to take on the entire burden of maintenance. Our "UPS as a service" is just another example of how we develop out of the box solutions to help our customers operate more efficiently; see our video to earn more.

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