KEMET's KONNEKT Technology uses transient liquid phase sintering.
KONNEKT Technology enhances power densities by integrating multiple components into single surface mountable package. Konnekt when implemented on ultra-stable U2J dielectric provides low-loss, low-inductance package that can operate on hundreds of kilohertz range. Unit developed on this technology can be mounted to PCBs through reflow processes and technology is compliant to ROHS standards.
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YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter
San Diego, California, USA – Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH. The award, sponsored by UP Media/Circuits Assembly magazine, was presented on Tuesday, February 17, 2017 at the...
Read More »Vishay Intertechnology at Electronica 2016 Nov. 8-11 Munich, Germany Hall A5 Booth 141-142, Hall A6 Booth A11-A13
New Products on Display at electronica 2016 vPolyTan™ Multi-Anode Solid Tantalum Chip Capacitors Increase Volumetric Efficiency to Lower Component Counts Combining polymer tantalum technology with Vishay's patented multi-array packaging (MAP), the T59 series offers up to 25 % better volumetric efficiency than similar devices, which allows for the industry's highest capacitance density....
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Modular Surface Mounter delivers placement rates to 200,000 CPH.
Supporting flexible and versatile production formats for OEMs and contract assemblers, Z:TA-R / YSM40R featuresÂ- 1 m wide compact platform, 4-beam layout, and multi-nozzle rotary head. High-speed side view camera checks status of components in real-time immediately after pickup as well as before and after mounting. Compatible with components down to 0201 metric (0.25 x 0.125 mm),...
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Glass vs. Plastic: Benefits of Using Glass Components in Biotechnology, Medical Device, Point-of-Care & Pharmaceutical Industries
This white paper from Accu-Glass outlines the various properties that make glass such an attractive option for a diverse range of medical-related applications.
Read More »Samtec to Present Technical Papers and Silicon-to-Silicon Product Demonstrations at DesignCon 2016
Samtec, Inc. will participate in the DesignCon 2016 conference and exhibition, January 19 - 21 at the Santa Clara Convention Center. Samtec will be featuring Silicon-to-Silicon product demonstrations, three 40-minute technical paper sessions, one 75-minute panel discussion and one 3-hour tutorial. The Silicon-to-Silicon product demonstration will include built-in pattern generation for bit rate,...
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Laser Direct Structuring (LDS) Pioneer A-Laser to Showcase MID Advances At BIOMEDevice San Jose
At the upcoming BIOME Device event, set to take place December 2nd and 3rd in San Jose, CA,Â- A-Laser, will highlight how its unique capabilities of Laser Direct Structuring (LDS) of Molded Interconnect Devices (MID), are lending new design and functionality freedom to the MID market.   From booth 219, A-Laser technology experts look forward to discussing LDS and...
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Universal to Demonstrate Fuzion, Share APL Expertise at SMTA International
Leading-edge technologies and expertise combine to deliver powerful solutions and maximum value. Universal Instruments will be exhibiting on Booth #306 at the SMTA International 2015 Exhibition in Rosemont, IL, on September 29–30. The company will feature its flagship Fuzion® surface mount platform on the booth, demonstrating the versatile performance of its Fuzion2-60™. Experts from...
Read More »In House MMIC Development Suit
Elbit Systems EW and SIGINT – Elisra receives much attention at TheÂ- IMS2015 in Phoenix. MMIC Devices: • Passive and Active 0.15um PHEMT GaAs MMIC's DC – 50 GHz • Passive components printed on hard substrates • Multi Function Integrated Circuits • Multi Layer Technology • In House On-Wafer (Probe Station) Testing • Multi Layer Buried Components
Read More »Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at OFC 2015
Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products MALVERN, Pa.Â- – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2015 Optical Fiber Communications Conference and Exhibition (OFC 2015), taking place March 22-26 at the Los Angeles...
Read More »Yamaha to Showcase the Sigma(TM) Series Mounter Platform at APEX 2015
Kennesaw, GA, USAÂ- – Yamaha Motor Co., Ltd. is finalizing an aggressive transition plan to incorporate the Hitachi Sigma Mounter Platform into their already extensive portfolio of SMT Mounters, Printers, Dispensers, Hybrid Placers and Inspection / X‐Ray Machines. This follows the announcement in September 2014 whereby Hitachi High‐Technologies Corporation (TOKYO: 8036; Hitachi...
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Von Ruden's Driven Tools Are Built to Last
Von Ruden's driven tools are designed to each specific machine in order to maximize performance. All of our tools are performance tested and made in the USA per ISO 9001:2015 standards. Check out our video to learn more.
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