New SMT Noise Sources Feature High Output ENR Levels Ranging from 31 to 51 dB
Provide a source of additive white gaussian noise with a crest factor of 5:1. Boast a noise output power level of -5dBm as well as can operate over a wide temperature range of -55°C to +125°C. Applications include communication systems, microwave radio, test and measurement, base station infrastructure and telecom data links.
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KEMET's KONNEKT Technology uses transient liquid phase sintering.
KONNEKT Technology enhances power densities by integrating multiple components into single surface mountable package. Konnekt when implemented on ultra-stable U2J dielectric provides low-loss, low-inductance package that can operate on hundreds of kilohertz range. Unit developed on this technology can be mounted to PCBs through reflow processes and technology is compliant to ROHS standards.
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YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter
San Diego, California, USA – Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH. The award, sponsored by UP Media/Circuits Assembly magazine, was presented on Tuesday, February 17, 2017 at the...
Read More »Vishay Intertechnology at Electronica 2016 Nov. 8-11 Munich, Germany Hall A5 Booth 141-142, Hall A6 Booth A11-A13
New Products on Display at electronica 2016 vPolyTan™ Multi-Anode Solid Tantalum Chip Capacitors Increase Volumetric Efficiency to Lower Component Counts Combining polymer tantalum technology with Vishay's patented multi-array packaging (MAP), the T59 series offers up to 25 % better volumetric efficiency than similar devices, which allows for the industry's highest capacitance density....
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A True Game-Changer For Walk-In Unit Frame Performance
This white paper outlines the eight reasons why the FUSIONFRAME system is the superior thermal envelope system. Download now to find out more.
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Modular Surface Mounter delivers placement rates to 200,000 CPH.
Supporting flexible and versatile production formats for OEMs and contract assemblers, Z:TA-R / YSM40R featuresÂ- 1 m wide compact platform, 4-beam layout, and multi-nozzle rotary head. High-speed side view camera checks status of components in real-time immediately after pickup as well as before and after mounting. Compatible with components down to 0201 metric (0.25 x 0.125 mm),...
Read More »Samtec to Present Technical Papers and Silicon-to-Silicon Product Demonstrations at DesignCon 2016
Samtec, Inc. will participate in the DesignCon 2016 conference and exhibition, January 19 - 21 at the Santa Clara Convention Center. Samtec will be featuring Silicon-to-Silicon product demonstrations, three 40-minute technical paper sessions, one 75-minute panel discussion and one 3-hour tutorial. The Silicon-to-Silicon product demonstration will include built-in pattern generation for bit rate,...
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Laser Direct Structuring (LDS) Pioneer A-Laser to Showcase MID Advances At BIOMEDevice San Jose
At the upcoming BIOME Device event, set to take place December 2nd and 3rd in San Jose, CA,Â- A-Laser, will highlight how its unique capabilities of Laser Direct Structuring (LDS) of Molded Interconnect Devices (MID), are lending new design and functionality freedom to the MID market.   From booth 219, A-Laser technology experts look forward to discussing LDS and...
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Universal to Demonstrate Fuzion, Share APL Expertise at SMTA International
Leading-edge technologies and expertise combine to deliver powerful solutions and maximum value. Universal Instruments will be exhibiting on Booth #306 at the SMTA International 2015 Exhibition in Rosemont, IL, on September 29–30. The company will feature its flagship Fuzion® surface mount platform on the booth, demonstrating the versatile performance of its Fuzion2-60™. Experts from...
Read More »In House MMIC Development Suit
Elbit Systems EW and SIGINT – Elisra receives much attention at TheÂ- IMS2015 in Phoenix. MMIC Devices: • Passive and Active 0.15um PHEMT GaAs MMIC's DC – 50 GHz • Passive components printed on hard substrates • Multi Function Integrated Circuits • Multi Layer Technology • In House On-Wafer (Probe Station) Testing • Multi Layer Buried Components
Read More »Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at OFC 2015
Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products MALVERN, Pa.Â- – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2015 Optical Fiber Communications Conference and Exhibition (OFC 2015), taking place March 22-26 at the Los Angeles...
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High or Low Volume Custom Crates and Boxes Available from Reid Packaging
Reid provides mil-spec crates and corrugated boxes in custom dimensions from single to triple wall and will even package them on-site. Check out the video to learn more.
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