Solder

World's First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized by NPI Award
Placement Equipment

World's First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized by NPI Award

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 NPI Award in the category of Component Placement – Multi-function for its multi-functional SMT Center. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX...

Read More »
Nihon Superior's New General Purpose Solder Wire Wins a 2014 NPI Award
Electric Wire

Nihon Superior's New General Purpose Solder Wire Wins a 2014 NPI Award

OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a 2014 NPI Award in the category of Cored Wire for its SN100C (031) Lead-free Flux-Cored Solder Wire. The award was presented to Mr. Tetsuro Nishimura, company president, during a Tuesday, March 25, 2015 ceremony that took place at the Mandalay Bay...

Read More »
Flux

Henkel's APEX Presence Brings High Reliability and High Performance to the Fore

Broad Range of Solder and Protection Materials to be Demonstrated During Three-Day Event At the annual APEX event, set to take place March 25-27 in Las Vegas, Nevada, show delegates will have the opportunity to learn more about the innovation that has resulted in several new high-reliability, high-performance materials from The Electronics Group of Henkel.Â-  Spanning a wide range of...

Read More »
Indium Corporation Features BiAgX(TM): New, High Temperature, Lead-Free Solder Paste Technology at Semicon China
Solder

Indium Corporation Features BiAgX(TM): New, High Temperature, Lead-Free Solder Paste Technology at Semicon China

Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China. BiAgX™ was created specifically for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor...

Read More »
The Balver Zinn Group to Showcase OT2 and WW50 at APEX
Flux

The Balver Zinn Group to Showcase OT2 and WW50 at APEX

The Balver Zinn Group announces that it will exhibit in Booth #2714 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort Convention Center in Las Vegas, NV. Representatives from Balver Zinn and Cobar will display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services. OT2 is Cobar’s latest halide and...

Read More »
Cobar Solder Products Goes to Texas for the SMTA Dallas and Houston Expos
Solder

Cobar Solder Products Goes to Texas for the SMTA Dallas and Houston Expos

The Balver Zinn Group announces that Cobar Solder Products will exhibit at the SMTA Dallas and SMTA Houston Expos. The SMTA Dallas Expo is scheduled to take place March 4, 2014 at the Plano Center in Plano, TX, and the SMTA Houston Expo will take place March, 6 2014 at the Stafford Centre in Stafford, TX. Representatives from Cobar will display the company’s OT2 solder paste and BRILLIANT B2012...

Read More »
Indium Corporation Features SACM(TM) High-Reliability Solder Paste at APEX
Solder

Indium Corporation Features SACM(TM) High-Reliability Solder Paste at APEX

Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada. SACM™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese...

Read More »
Flux

Solder Pastes help reduce potential for tombstoning.

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduceÂ- melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au,...

Read More »
Pb-Free Solder Paste targets small, low-voltage QFN packages.
Solder

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Read More »
Fresh Air Intake Designed to Meet ASHRAE 62.2 standards
Sponsored

Fresh Air Intake Designed to Meet ASHRAE 62.2 standards

Alan Manufacturing has a long history of developing innovative solutions for HVAC applications. With over 1,000 product designs under our belt, we have gained a reputation as the go-to source for HVAC dampers, hardware, duct supports, zone control systems, and much more. Adding to this extensive list of achievements we now announce the release of our new line of Fresh Air Intake products. Designed to meet ASHRAE 62.2 standards, they are the most robust and high-performance product of their kind. See our video to learn more.

Read More »

All Topics