Solder

FCT Assembly to Exhibit Solution Driven Solder Pastes at SMTA Space Coast
Rubber / Foam Cutters and Cutting Machinery

FCT Assembly to Exhibit Solution Driven Solder Pastes at SMTA Space Coast

GREELEY, COÂ- – FCT Assembly today announced plans to exhibit at the Space Coast and Tampa Bay Expo Tech Forum, scheduled to take place Thursday, December 4, 2014 at the Park Inn by Radisson in Kissimmee, FL. Solder expert Rodney Wade will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution-driven solder pastes. The NanoSlic® Gold stencil is the next...

Read More »
Universal Electronics Purchases Kurtz Ersa's POWERFLOW N2
Soldering Machinery

Universal Electronics Purchases Kurtz Ersa's POWERFLOW N2

Plymouth, WIÂ- – Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that Universal Electronics, Inc. (UEI) has purchased a POWERFLOW N2 full nitrogen tunnel wave solder machine. UEI has been providing contract electronics manufacturing services to medical, industrial-commercial, communication and security OEMs since 1980. The system...

Read More »
Solder

Indium Corporation Wins Global Technology Award

Indium Corporation was presented with the Global Technology Award for its BiAgX® solder paste at SMTA International in Rosemont, Ill. on Tuesday, September 30. Sponsored by Global SMT Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years. BiAgX® was created specifically for...

Read More »
Rework Solder Paste desolders Pb-free components.
Flux

Rework Solder Paste desolders Pb-free components.

With desoldering temperature of 180°C,Â- RoHS-compliant Bi Rework Solder Paste provides optimized removal of through-hole and SMT components, including LEDs. No-clean, halide-free flux minimizes risk of board damage during desoldering process. In addition, product offers easy dispensing and clean-up.

Read More »
Encapsulants

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Albany, NYÂ- – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant. YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications,...

Read More »
Stencils

FCT Assembly to Exhibit Innovative Pastes and Stencils at OctoberBest

GREELEY, CO — FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR. Derek Stuart, FCT's National Sales Manager, will be available to discuss the complete line of solution driven solder pastes and stencils. FCT Assembly offers solder pastes that are specially formulated to solve...

Read More »
Flux

Indium Corporation Features RMA-155 Pb-Free Solder Paste at SMTAi

Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill. RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers...

Read More »
FCT Assembly to Exhibit Solution-Driven Solder Pastes at the SMTA Capital Expo
Solder

FCT Assembly to Exhibit Solution-Driven Solder Pastes at the SMTA Capital Expo

GREELEY, CO - FCT Assembly today announced plans to exhibit at the SMTA Capital Expo Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD. Solder experts Rodney Wade and Dinesh Patel will be available to discuss FCT’s line of solution driven solder pastes. FCT Assembly offers solder pastes that are specially formulated...

Read More »
World's First SMT Assembler with Integrated Solder Paste Jet Printer at SMTAI
Assembly Machinery

World's First SMT Assembler with Integrated Solder Paste Jet Printer at SMTAI

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it will highlight the Paraquda 2 with integrated solder paste jet printer in Booth #640 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Essemtec has merged its dispensing and pick-and-place know-how from the...

Read More »
The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI
Flux

The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Representatives from Balver Zinn and Cobar will display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services. OT2 is Cobar’s latest halide and...

Read More »

All Topics