Solder

Solder Paste features colored labeling for identification.
Solder

Solder Paste features colored labeling for identification.

SolderPlus® dispensable solder paste formulations are packaged in 3, 5, 10, 30, and 55 cc syringes with green end caps and green leaf label design for immediate recognition on production floor. Tin/silver, tin/silver/copper, and tin/bismuth alloys have low liquidus temperatures from 217 to 138° C, and provide precise, consistent solder deposits when applied with air-powered dispensing...

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Solder Paste remains soft and pliable.
Solder

Solder Paste remains soft and pliable.

SynTECH(TM) no-clean solder paste is made with synthetic poly adducts and yields reliable solder joints in SMT PC board assemblies. It offers wide process windows with 12 to 18 hr stencil life and 18 to 24 hr tack time. Paste leaves non-conductive, non-corrosive post reflow residue, which acts as protective coating. SynTECH requires no refrigeration. It is suitable for in-circuit testing of fine...

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Solder Paste joins hard-to-solder materials.
Solder

Solder Paste joins hard-to-solder materials.

SolderPlus with WS421 flux offers aggressive flux chemistry that provides suitable bonding strength for mechanical assembly applications. Available in lead-free and tin/lead solder paste alloys, it is prepackaged in EFD syringes for precise application with automatic dispensing equipment. Solder paste works successfully on hard-to-solder materials such as stainless steel 304 and 316, Nichrome,...

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Solder

Solder Paste eliminates tombstone defects.

Loctite® Multicore® 63S4 RP15 phased-reflow, no clean solder paste is formulated with 63S4 alloy. 63S4 alloy blends SN63 and SN62, with melting points of 183°C and 179°C respectively. In phased reflow process, small amounts of SN62 wets both sides of termination before SN63's melting point is reached, tack-soldering components to PCB, and delivering larger assembly process...

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Solder Paste produces consistent joints without cleaning.
Solder

Solder Paste produces consistent joints without cleaning.

SolderPlus No Clean solder paste prepackaged alloy/flux blend is formulated for controlled application by automatic dispensing equipment. It provides control and speed in production soldering processes by producing consistent solder deposits without needing to remove flux residue. This tacky paste is suitable for electronic, electromechanical and telecommunications applications.

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Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)
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Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)

Fiber Reinforced Polymers (FRP), represents a truly groundbreaking advancement in structural reinforcement. Lightweight, strong, and green, they are changing the way the construction industry thinks about rebar. Unlike steel, FRPs don't rust and are far stronger than standard rebar. To learn why Fiber Reinforced Polymers are poised to change the way the world builds, see our video.

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