Solder

Solder

Solder Paste resists effects of humidity.

Suited for various process conditions, Multicore® MP218 is pin-testable and has halide-free, no-clean formulation. Slump-resistant product is available in Sn62, Sn63, and 63S4 alloys and is suitable for reflow in air or nitrogen. With open time exceeding 24 hr, paste has 1.6 g/mmÂ-² initial tack force rating, which makes it resistant to component movement during high-speed placement....

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Water-Soluble Solder Paste is lead-free.
Solder

Water-Soluble Solder Paste is lead-free.

Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges.

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Solder Wire is comprised of high-purity materials.
Solder

Solder Wire is comprised of high-purity materials.

Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available.

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Solder

No-Clean Solder Paste offers batch-to-batch repeatability.

Type R905 lead-free solder paste is engineered for high thermal demand of assembling with elevated melting temperatures of lead-free alloys. It provides consistent release from stencil for critical, 0.4 mm fine-pitched applications with anti-slump characteristics and preferred solder deposit definition. Printing characteristics remain constant with print speeds up to 6 ips. Paste is 0201 capable...

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Solder

Solder Paste reduces voiding of bumps on wafer/substrate.

Water-soluble SE-CURE® 7101 has activator package that is formulated to exhibit uniform wetting to various under-bump metallurgies, reducing bump's voiding level to less than 10%. Residues can be removed, post-reflow, with cool or warm deionized water. It releases cleanly from stencil apertures with area ratios of 1.5 and smaller. Thermally stable flux system is compatible with tin/lead and...

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Solder

Solder Paste offers wide process window.

Multicore® LF320 lead-free solder paste is optimized for reflow in air on wide range of PCB assembly applications. It requires minimum peak reflow temperature of 229°C. With print speed range of 25-100 mms-1, and abandon time up to 2 hr, paste provides high resistance to slump and solder balling. LF320 is classified as ROMO and meets or exceeds Bellcore GR-78-CORE tests for...

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Solder

Printing Paste features splatter-free flux.

PrintPlus(TM) prevents scatter of flux that results from outgassing during solder paste preheat and reflow processes. By eliminating unwanted flux residue on gold fingers, wire bonding pads, and other circuit board areas, paste reduces defects in subsequent assembly operations. No-clean flux system is offered with variety of solder alloys, including lead-free.

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Solder

Solder Paste suits high speed printing processes.

Multicore® WS200 water washable solder paste features long open and abandon time capabilities. High activity flux is highly resistant to humidity and slump, and minimizes any defects due to voiding. There is no visible residue on PCBs washed up to 3 days after being reflowed. Paste is available with standard ANSI J-STD-006 Type 3 tin lead alloys. It meets or exceeds test specifications of...

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Solder

Solder Paste suits high speed printing processes.

Lead-free, no-clean Multicore® LF300 provides high resistance to slump and solder balling. Clear residues are pin probable for improved in-circuit test performance. Paste is optimized for small to medium size boards at nominal 240-245°C temperatures. Reflow profiles may be extended with nitrogen. Typical applications include mobile phones, PDA assemblies, remote control devices,...

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Solder

Solder Paste suits high-speed printing processes.

Multicore® 63S4 MP200 no-clean solder paste is formulated with 63S4 alloy that eliminates tombstone defects and reduces component misalignment. Paste delivers extended abandon time, long open time, and slump resistance. It is suitable for HASL, OSP copper, gold over nickel, and silver immersion. Multicore 63S4 meets or exceeds test specifications of J-STD-004 for copper mirror, copper...

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