Solder

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI
Flux

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #504 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the...

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Inspection Equipment

Absolute EMS Adds CyberOptics SPI and AOI Inspection Systems to Its Expanding Lines

CyberOptics Corporation (Nasdaq: CYBE) a world leader in AOI and SPI inspection solutions for the global electronics assembly and semiconductor capital equipment markets, announces that Absolute EMS has purchased both its SPI and AOI inspection systems as part of its recent expansion. CyberOptics’ SE500 SPI system will provide Absolute EMS the advantage of accurately measuring solder paste and...

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Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI
Flux

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

OSAKA, JAPAN- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #504 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the...

Read More »
Inspection Equipment

Absolute EMS Adds CyberOptics SPI and AOI Inspection Systems to Its Expanding Lines

CyberOptics Corporation (Nasdaq: CYBE) a world leader in AOI and SPI inspection solutions for the global electronics assembly and semiconductor capital equipment markets, announces that Absolute EMS has purchased both its SPI and AOI inspection systems as part of its recent expansion. CyberOptics’ SE500 SPI system will provide Absolute EMS the advantage of accurately measuring solder paste and...

Read More »
Solder

Halogen-Free Solder Paste offers consistent print performance.

Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion...

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Solder

Halogen-Free Solder Paste offers consistent print performance.

Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion...

Read More »
Solder Alloy maximizes drop shock performance of electronics.
Solder

Solder Alloy maximizes drop shock performance of electronics.

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect.- SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without...

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Solder Alloy maximizes drop shock performance of electronics.
Solder

Solder Alloy maximizes drop shock performance of electronics.

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect.Â- SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without...

Read More »
Nihon Superior to Address Soldering Challenges at NEPCON South China
Flux

Nihon Superior to Address Soldering Challenges at NEPCON South China

OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics...

Read More »
Nihon Superior to Address Soldering Challenges at NEPCON South China
Flux

Nihon Superior to Address Soldering Challenges at NEPCON South China

OSAKA, JAPAN- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics...

Read More »

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