Solder

Low-Voiding Solder Paste suits fine-pitch applications.
Solder

Low-Voiding Solder Paste suits fine-pitch applications.

Designed for high-volume stencil printing applications with CSP lead pitches of 0.5 and 0.4 mm, Multicore® LF328 is formulated to deliver low voiding in BGA joints. It provides tack force sufficient to resist component movement during high-speed placement and enables print speeds with print pressure that minimizes board warpage. Classified as ROL0 to ANSI/J-STD-004, is halide-free, no-clean...

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Solder

Solder Paste suits extended heating profiles.

Intended for Pb-free and N2-free processing, SAC-XM7S remains stable and active during extended heating at elevated temperatures and does not require nitrogen blanket. It is available in most common SAC-alloys, including anti-Tombstoning type, and in several powder classes.

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Solder

Solder Paste suits multiple-step component assembly.

High-temperature, lead-free Type SN89/SB10.5/CU0.5 features solidus temperature of 242°C, 22°C delta above SAC. It exhibits tensile strength of 12,000 psi and has pasty range of 21°C from 263-242°C, which minimizes tombstoning. Available in all flux systems and alloy types II, III, IV, and V, dispensing and printing paste is suited for multi-step assembly where component...

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Solder Pallet Material enhances electronics assembly.
Miscellaneous Materials

Solder Pallet Material enhances electronics assembly.

Suited for high-temperature solder pallets, WaveMax(TM) 5000 thermoset composite material supports continuous operating temperature of 260°C and withstands exposures to heat up to 360°C. Construction combines non-woven random glass mat substrate and static dissipative epoxy resin system. Machineable material has flexural strength of 30,000 psi and maintains flexural strength to 13,600...

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Paste

Die Attach Material bonds same size die stack packages.

Hysol® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric...

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Stencils

Products and Services offer comprehensive lead-free solution.

DEK Lead-Free(TM) Branded products include stencils for lead-free solder paste, squeegees and cleaning materials, lead-free stencil storage, and lead-free Printer Caddy. Formalized approach to implementing lead-free pre-placement begins with focused process audit and Site Implementation Plan methodology. Tutored workshop sessions are provided with unlimited Q and A, allowing customers to gain...

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Flux

Solder Powder/Flux allows soldering irons to be re-tinned.

Multicore® TTC-LF consists of lead-free grade solder powder and flux, formed into shape of thick disk for cleaning and de-wetting soldering irons. Users wipe tip of iron across surface of TTC-LF to produce local melting, and then wipe on damp sponge. Suited for lead and lead-free applications, product features activators that thermally decompose into inert components, and ability to clean...

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Solder

Lead-Free Solder Paste suits high-speed printing processes.

Available in lead-free alloys 96SC and 97SC, water-washable Multicore WS300 is resistant to humidity and slump, and is formulated to minimize any defects due to voiding. Paste is classified as ORH1 and meets or exceeds test specifications of ANSI/J-STD-004 and 005 for SIR, corrosion, fluorides, and slump. Product also meets Bellcore GR-78-CORE tests for electromigration and SIR.

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Solder

Lead-Free Solder Paste exhibits humidity resistance.

Multicore® LF318 is a halide-free, no-clean, pin-testable formulation that offers broad process windows for printing and reflow. Offering open time greater than 24 hr, paste provides initial tack force of 2.0 g/mmÂ-². It achieves high degree of coalescence upon reflow, even after 72 hr at 27°C and 80% RH. Suitable for reflow in air or nitrogen, product displays solderability on...

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