Solder

Solder

S-Bond Technologies Takes License to EWI Sonicsolder

S-Bond to Sell EWI's Lead-free, Fluxless Solder (Lansdale, PA) - S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI's patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum,...

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Die Attach Solder Paste targets screen print operations.
Solder

Die Attach Solder Paste targets screen print operations.

Formulated for printing processes, Multicore DA101 can not only handle reflow with high-lead alloys, but with lead-free based alloys as well. Product withstands temperatures of 300-330°C for high-lead reflow profiles and tolerates lead-free temperatures from 240-270°C. Delivering wetting ability to variety of surfaces, adaptable paste exhibits less than 5% void instances on average....

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Sputtering Targets

S-Bond Joining Materials and Services for the Manufacture of Sputtering Targets

S-Bond® active solders enable the joining of dissimilar metals and ceramics to each other and to other metals. S-Bond's patented alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the metallic and/or ceramic surfaces prior to bonding. S-Bond filler metal alloys produce reliable joints with...

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Solder

Die Attach Solder Paste has enhanced thermal control.

Suitable for high-Pb and Pb-free applications, Multicore® DA100(TM) addresses thermal requirements of smaller outline, higher functioning power semiconductor devices. It incorporates no clean, ROLO flux system and uses specific high-temperature, Pb-free alloys to offer thermal control necessary for rectifiers, power transistors, amps, and other components. Exhibiting less that 5% void...

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Solder Paste is lead and halide free.
Solder

Solder Paste is lead and halide free.

Offering solderability over wide range of reflow profiles in both air and nitrogen, Multicore® LF700 works on Ni/Au, immersion Sn, immersion Ag, and OSP copper surface finishes. Capable of reducing voiding in BGA solder joints, it delivers high tack force to provide stability during high-speed component placement and offers long printer abandon times of up to 4 hr even when printed onto...

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Chemicals

Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Irvine, California, April 8, 2009 The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever. Two Henkel electronics assembly...

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Powder recycles solder by separating dross.
Solder

Powder recycles solder by separating dross.

Applicable for wave soldering, Dross-B-Gone can recover 90% of pure solder originally used. Effective with both lead-free and lead solders, powder eliminates dross by oxidizing it into removable powder that is discarded, while pure molten solder remains in pot and becomes completely reusable. Non-polluting powder is sprinkled on molten solder at approximate ratio of 1/3 oz per 35.3 oz of solder...

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Miscellaneous Materials

Pb-Free Material aids semiconductor thermal management.

To improve operational reliability, Honeywell Pb-free Die Attach Solder helps manage heat produced by semiconductor chips by filling gap between chips and heat spreader. This lead (Pb)-free thermal interface material, intended to be used mainly in wire form, is designed to offer environmentally friendly alternative with combination of melting temperature, wetting behavior, and mechanical...

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