Solder

Metallization Paste supports solar cell processing.
Solder

Metallization Paste supports solar cell processing.

Designed for rotary screen printing, DuPont(TM) Solamet® PV414 enables high-speed roll to roll processing of thin and flexible solar cells and modules. Formula is engineered to ensure optimal printability and line resolution while maintaining adhesion to Transparent Conductive Oxide layer, low contact resistance, and maximum conductivity.

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Masks and Masking

Taiyo Showcases Diversified Product Selection at IPC APEX EXPO 2011

Taiyo America will be presenting a wide variety of products at the IPC show this year. With the support of Taiyo Holdings these products will be displayed as static items, graphically and digitally for the best hands on" experience possible. The products that will be showcased are Laser Direct Imaging Solder Mask products for flex and rigid, Ink Jet Legend, Dual Cure Type Marking Ink and White...

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Solder

Henkel's Hysol FP5201 NCP Enables New Copper Pillar Interconnect Technology

Henkel's non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold - Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects. Driven by the need to increase functionality while simultaneously maintaining...

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Solder

No-Clean Solder Paste offers hot slump resistance.

Suited for broad range of lead-free surface mount applications, 862 Solder Paste has broad processing window designed to minimize transition concerns from Sn/Pb process. Product yields no or low solder beading and bridging and optimal print performance across various board designs. Compliant with ROL0 IPC and IPC Class III voiding classifications, paste is compatible with most lead-free alloys,...

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Tin

Immersion Tin eliminates tin whisker formation.

Providing solderability for interconnect applications, Tinposit(TM) LF Immersion Tin produces uniform tin deposits on properly prepared PWB substrates and is specifically formulated for use in lead-free assembly processes. Product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.

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Solder

No-Clean Solder Paste has lead-free, synthetic formulation.

Made with 100% synthetic poly adduct components and suited for SMT assemblies, SynTECH-LF is compatible with tin/silver and tin/silver/copper alloys. Synthetic, non-organic formula optimizes lot-to-lot and stencil printing consistency and offers 12 hr stencil life and 12-16 hr tack time. Product leaves removable, non-conductive, non-corrosive, post reflow residue that acts as protective coating...

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Lead-Free Solder Paste withstands extreme climate changes.
Solder

Lead-Free Solder Paste withstands extreme climate changes.

Suited for handheld and automotive sectors, Multicore LF620 ensures consistent print performance with minimal hot slump, even in regions with temperatures of 86°F or more and RH upwards of 80%. No-clean, halide-free formula exhibits low voiding in CSP via-in-pad joints and optimal solderability over range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag, and OSP copper. Paste...

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Henkel to Show Latest Materials Innovations at APEX 2010
Thermal Management Materials

Henkel to Show Latest Materials Innovations at APEX 2010

Irvine, California - Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment - even throughout the recent downturn - has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources...

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Manncorp.com Launches New Turnkey Section Showcasing 7 Complete SMT Assembly Systems
Assembly Machinery

Manncorp.com Launches New Turnkey Section Showcasing 7 Complete SMT Assembly Systems

Manncorp has introduced seven new electronic assembly turnkey lines with throughput rates ranging from prototyping to 10,500 cph. The lines are described at manncorp.com/turnkey and according to CEO Henry Mann, are targeted to "OEMs and others who are considering turning away from outsourcing by bringing PCB assembly in-house for the first time. The systems are also beamed to existing assemblers...

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Lead-free Solder Paste creates joints with smooth, shiny finish.
Solder

Lead-free Solder Paste creates joints with smooth, shiny finish.

Multicore LF730 enables high-speed printing for extremely fine parts; apertures as small as 160 microns in diameter and stencils as thin as 80 microns have been successfully printed. Particle size distribution delivers more solder per aperture but with less risk of aperture clogging compared to traditional Type 4 pastes. Thermally stable product has shown consistent performance in environments as...

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