Solder

Solder

Lead-Free Solder Paste offers low voiding characteristics.

Formulated to deliver optimal reflow with minimum mid-chip balling, SN100C P810 D4 is based on silver-free and lead-free solder alloy SN100C®. Product also exhibits optimal wetting on all common substrates. Tests indicate that when used in combination with vacuum reflow paste can produce solder joints on 19 x 19 mm pads and joints to power transistors with less than 1% voiding.

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Implementing Lead-Free Soldering with Cost Reduction and Reliability
Flux

Implementing Lead-Free Soldering with Cost Reduction and Reliability

Nihon Superior to Offer Voiding Reduction and Aluminum Soldering at Jisso Protec 2012 OSAKA, JAPAN - Nihon Superior Co., Ltd., a supplier of advanced soldering materials to the global market, announces that it will showcase a new, expanded range of products at Jisso Protec 2012, which will be held at the Tokyo Big Sight from June 13-15, 2012. These products are based on the company's well-known...

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VOC-Free Flux passes SIR and corrosion testing requirements.
Flux

VOC-Free Flux passes SIR and corrosion testing requirements.

Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 2.6.3.7 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including...

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Koh Young Announces Delivery of 3000th SPI System
Inspection Equipment

Koh Young Announces Delivery of 3000th SPI System

Seoul, South Korea - Koh Young Technology announces the delivery of their 3000th 3D in-line Solder Paste Inspection (SPI) system - a KY8030-3 system - to Mack Technologies, a leading supplier of printed circuit board assembly, systems assembly, and electronics contract manufacturing services for the military, communications, industrial and medical industries. Mack Technologies operates in...

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AIM to Highlight NC259 No-Clean Solder Paste at NEPCON China 2012
Solder

AIM to Highlight NC259 No-Clean Solder Paste at NEPCON China 2012

AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012. The event is scheduled to take place April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center. NC259 solder paste has...

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Flux

Nihon Superior Shanghai to Exhibit at NEPCON China 2012

Implementing Lead-Free Soldering with Cost Reduction and Reliability OSAKA, JAPAN - Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai. Included...

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Cobar's Advanced Technologies Featured in the APEX Hand Solder Competition
Dispensers

Cobar's Advanced Technologies Featured in the APEX Hand Solder Competition

The Balver Zinn/Cobar Group announces that its SN100C Wire Solder and Cobrush flux applicator were demonstrated at the first Hand Solder Competition at the recently held IPC APEX EXPO in San Diego. During the two-day hand soldering competition, numerous companies competed to build a functional electronics assembly in 30 minutes. Assemblies were judged on soldering in accordance with IPC-A-610E...

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AIM to Highlight World-Class Solder Materials at SMTA Indiana 2012
Flux

AIM to Highlight World-Class Solder Materials at SMTA Indiana 2012

CRANSTON, RI - March 2012 - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight NC258, NC265LR, NC275LR & SN100C at the upcoming SMTA Indiana Expo & Trade Forum, scheduled to take place Tuesday, March 20, 2012 from 10 a.m.-3 p.m. at the Ritz Charles in Carmel, IN....

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New Electronic Materials to be Debuted at Productronica 2011 in Munich
Flux

New Electronic Materials to be Debuted at Productronica 2011 in Munich

Henkel solutions address miniaturization, sustainability and cost-efficiency in modern electronics As the functionality of modern electronics products has increased exponentially in tandem with decreasing dimensions, the demands on performance and reliability of electronic materials have reached an unprecedented level. Today's electronic materials - spanning nearly all market sectors - must...

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Solder

DuPont Microcircuit Materials Introduces New Lower-Silver Solamet® Photovoltaic Metallization

New Solamet® PV51M Designed to Drive Costs Down for Solar Cell Manufacturers RESEARCH TRIANGLE PARK, N.C., - DuPont Microcircuit Materials (MCM) has introduced DuPont(TM) Solamet® PV51M photovoltaic metallization paste, a new tabbing material used in solar cell manufacturing. This breakthrough new formulation enables cell makers to use up to 15 percent less material, in line with the...

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Oilfield Improvements® Wheeled Rod Guide® Couplings Celebrate 35th Anniversary
Sponsored

Oilfield Improvements® Wheeled Rod Guide® Couplings Celebrate 35th Anniversary

For over 35 years our Wheeled Rod Guide Couplings, have been at work in oil fields across the globe. Our products are engineered to extend the service life of sucker rods and tubing, delivering cutting-edge innovation that enhances oilfield operation, maximizes output, and enhancing overall operations. To learn about the advantages of using Wheeled Rod Guide Couplings in your wells, see our video.

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