Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
Read More »ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd
ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...
Read More »Henkel Solder and Thermal Innovations Earn Industry Recognition
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Ã- Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its LoctiteÃ-® GC 3W and Gap PadÃ-® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...
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Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste
OSAKA, JAPANÃ- – Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San...
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How to Choose a Servo Controller for Your Application
Choosing the best controller for your specific application is of the utmost importance. This white paper offers an overview of feature and motion profile considerations.
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Reflow Soldering System offers void-free results. .
Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures...
Read More »Taiyo Showcases Diversified Product Selection at IPC APEX EXPO 2011
Taiyo America will be presenting a wide variety of products at the IPC show this year. With the support of Taiyo Holdings these products will be displayed as static items, graphically and digitally for the best hands on experience possible. The products that will be showcased are Laser Direct Imaging Solder Mask products for flex and rigid, Ink Jet Legend, Dual Cure Type Marking Ink and White...
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Henkel to Show Latest Materials Innovations at APEX 2010
Irvine, California - Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment - even throughout the recent downturn - has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources...
Read More »Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul
Irvine, California, April 8, 2009 The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever. Two Henkel electronics assembly...
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Powder recycles solder by separating dross.
Applicable for wave soldering, Dross-B-Gone can recover 90% of pure solder originally used. Effective with both lead-free and lead solders, powder eliminates dross by oxidizing it into removable powder that is discarded, while pure molten solder remains in pot and becomes completely reusable. Non-polluting powder is sprinkled on molten solder at approximate ratio of 1/3 oz per 35.3 oz of solder...
Read More »Pb-Free Material aids semiconductor thermal management.
To improve operational reliability, Honeywell Pb-free Die Attach Solder helps manage heat produced by semiconductor chips by filling gap between chips and heat spreader. This lead (Pb)-free thermal interface material, intended to be used mainly in wire form, is designed to offer environmentally friendly alternative with combination of melting temperature, wetting behavior, and mechanical...
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ISO-Certified Plastic Injection Molding from Rodon
The Rodon Group is a proven leader in high-volume, close tolerance injection molding. We offer globally competitive, innovative manufacturing solutions for a broad range of industries. Check out our video to learn more.
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