Solder

VOC-Free Solder Paste has environmentally safe formulation.
Flux

VOC-Free Solder Paste has environmentally safe formulation.

Able to withstand thermal preheats required for palletized selective soldering, NC277Â- halide-free liquid flux has medium residue suitable for extended thermal demands. Product provides broad activation range, accommodating various process parameters and applications that include lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other...

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Solder Paste minimizes post-process residue and graping.
Solder

Solder Paste minimizes post-process residue and graping.

Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigatingÂ- head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature.

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FCT Assembly Wins Solder Paste Evaluation Conducted by Major OEM
Solder

FCT Assembly Wins Solder Paste Evaluation Conducted by Major OEM

GREELEY, COÂ- - FCT Assembly today announced that it won a major OEM in the Northwest with its NL932 lead-free no-clean solder paste. The OEM evaluated six solder paste suppliers. The evaluation was comprised of several tests broken into distinct phases. Analytical tests included tackiness, wetting, cold and hot slump, voiding in BGAs, AOI performance, and ease of cleaning. Extended paste...

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Water-Soluble Solder Paste minimizes voids.
Flux

Water-Soluble Solder Paste minimizes voids.

Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump...

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Tin/Bismuth Solder Paste features low-melting formulation.
Miscellaneous Metals

Tin/Bismuth Solder Paste features low-melting formulation.

With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lendsÂ- repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high...

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Imaging Equipment

Rehm Thermal Systems Show VisionXP+ for the First Time at SMT

On display at SMT Nuremberg for the first time will be Rehm Thermal Systems’ VisionXP+ . Visitors to Hall 7, Stand 7-329 will be able to see yet another creative development from the award-winning Rehm, designed to enhance convection reflow productivity and boost energy efficiency. The VisionXP+ can reduce energy consumption by up to 20%. The VisionXP+ system is based on the tried and tested...

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AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013
Flux

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

CRANSTON, RIÂ- - April 8, 2013 - AIM Solder, a global leader in the manufacture of solder assembly materials for the electronics industry, will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center. This low-cost, lead-free and halogen-free solder paste offers the...

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SMTSOLDERPASTE.COM Offers Same-Day Shipping
Inspection Equipment

SMTSOLDERPASTE.COM Offers Same-Day Shipping

Lead-free, lead-free/halogen-free and tin/lead solder pastes are available for immediate online purchase from SMTSolderPaste.com in 500-gram jars, 600-gram tubes and 10cc syringes. Quantity prices are as low as $46 per 500-gram jar for tin/lead (Sn63/Pb37) paste and $76 per 500-gram jar for lead-free (SAC305) paste. Offering exceptional wetting, low voiding, high tack and excellent shelf and...

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AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show
Flux

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Cranston, Rhode Island- AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA. This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can...

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The Balver Zinn Group to Highlight a Host of Solder Materials during SMT/HYBRID/PACKAGING 2013
Flux

The Balver Zinn Group to Highlight a Host of Solder Materials during SMT/HYBRID/PACKAGING 2013

The Balver Zinn Group will exhibit numerous leading-edge products at the upcoming SMT/HYBRID/PACKAGING on booth #9-312, which is scheduled to take place from 16-18 April 2013 at the exhibition center in Nuremberg, Germany. Among the innovative technologies will be Cobar’s wide range of state-of-the-art fluxes, including VOC-free, low-VOC and VOC. • 396-DRX-M+ is a VOC-free flux that exhibits...

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