Microchip Technology, Inc.'s MPLAB X Now Supports AVR Microcontrollers
Software

Microchip Technology, Inc.'s MPLAB X Now Supports AVR Microcontrollers

Microship Technology Inc. has recently released version 5.05 of it's MPLAB X Integrated Development Environment (IDE). The update features the ability to evaluate and incorporate AVR MCUs into it's application. The development capabilities of the MPLAB X are cross-platform and scalable with compatibility on Windows, macOS, and Linux operating systems. The enhanced tool chain also provides support...

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New Test Suite Supports Variety of Procedures for Testing Inter-Operability
Software

New Test Suite Supports Variety of Procedures for Testing Inter-Operability

The End-to-End Wireless Network Simulation Test Suite (4G LTE + IMS, 3G, 2G) from GL Communications Inc. was recently enhanced to support a variety of procedures for testing inter-operability between networks. The test suite provides integrated solutions to vendors and service providers for simulating, monitoring and troubleshooting any wireless network. It has the ability to support up to 64,000...

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New Test Suite Supports Variety of Procedures for Testing Inter-Operability
Software

New Test Suite Supports Variety of Procedures for Testing Inter-Operability

The End-to-End Wireless Network Simulation Test Suite (4G LTE + IMS, 3G, 2G) from GL Communications Inc. was recently enhanced to support a variety of procedures for testing inter-operability between networks. The test suite provides integrated solutions to vendors and service providers for simulating, monitoring and troubleshooting any wireless network. It has the ability to support up to 64,000...

Read More »
Software

New Platform for TSMC's Multi-die 3D-IC Advanced Packaging Technologies Designed by Synopsys

Synopsis designs a new platform for TSMC WoW direct stacking. The product features multi-die and interposer layout implementation, parasitic extraction, timing analysis with physical verification. The reference flow allows customers to see the potential of 3D-IC for high-performance and low-power applications. The design allows customer deployments for high-performance and connectivity within...

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