Memory Sockets accept very low profile DDR2 memory modules.
Electronic Sockets

Memory Sockets accept very low profile DDR2 memory modules.

Offered with through-mount leads for solder termination, 240-position Series 10052286 provides mechanical voltage keying and end latches that minimize overall profile. Nominal 18.3 mm VLP memory module installed in sockets achieves combined vertical height of less than 21.5 mm. Solder tail options support use on .062-.093 in. thick motherboards. Applications include blade servers, sub-1U routers,...

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Large-Drive Impact Sockets spread stress over large area.
Tool Sockets

Large-Drive Impact Sockets spread stress over large area.

Made from special alloy steel, Proto® impact sockets are heat treated for optimal balance of strength and hardness. Fractional and metric sockets for 1Â-½ in. drive line, along with 2½ in. drive fractional sockets, comprise 68-piece offering suited for extreme heavy-duty use industries such as mining, oil/gas, and utilities. One-piece construction ensures concentricity, and...

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Impact Hex Bit Sockets come in inch and metric sizes.
Tool Sockets

Impact Hex Bit Sockets come in inch and metric sizes.

Offered in standard length, 3/8 and Â-½ in. drive Impact Hex Bit Sockets have replaceable hex bits that are held with set screw. Replaceable bit sizes for 3/8 in. drive socket include 1/8, 5/32, 3/16, 7/32, ¼, 5/16, and 3/8 in. as well as 2, 2.5, 3, 4, 5, 6, 7, 8, and 10 mm. Replaceable bit sizes for ½ in. socket include ¼, 5/16, 3/8, 7/16, ½, 9/16, and 5/8...

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BGA Socket suits 1.00 mm pitch devices.
Electronic Sockets

BGA Socket suits 1.00 mm pitch devices.

Designed for development, test, and validation of BGA and LGA devices at speeds up to 2.6 GHz, Flip-Top(TM) BGA Socket requires no soldering of IC and needs no external hold-downs or tooling holes in PCB board. It features single-ended insertion loss of -.060 dB at 2.6 GHz and differential insertion loss of -2.80 dB at 5.0 GHz. Available for thru-hole or surface mount applications, unit includes...

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Spring Sockets

QFN Socket attaches 0.4 mm pitch devices.

Rated for up to 500,000 actuation cycles, SS-QFN104A-01 socket dissipates up to 7 W over temperature range of -40 to +120°C without need for additional heatsink and operates at 11.5 GHz bandwidth with less than 1 dB insertion loss. Utilizing high endurance spring pins, it accommodates chip with 104 pins plus ground pad; current carrying capacity is 1.5 A/pin and actuation force is 20 gm/pin...

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Electronic Sockets

BGA Socket accommodates 1.0 mm pitch ICs.

Intended for 23 mm, 22X22 array ICs, 10 GHz Model SS-BGA324J-02-01 dissipates up to 7 W without extra heatsinking and can handle up to 60 W with custom heatsink. Contact resistance is typically 30 mOhm per ball. Constructed with spring pins rated at 500,000 actuations, socket operates from -40 to +150°C. Pin inductance is 1.3 nH and mutual inductance is 0.62 nH typically. Capacitance to...

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Processor Socket enables PCI Express® signaling.
Electronic Sockets

Processor Socket enables PCI Express® signaling.

Lead-free, 775-position Model LGA775 enables use of microprocessors that support PCI Express signaling in desktop PCs. Utilizing BGA technology for motherboard attachment and LGA interface to microprocessor, socket performs with less than 4 nH inductance and less than 1 pF capacitance pin-to-pin. Pickup cover facilitates placement using pick-and-place equipment, while BGA termination allows...

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Socket is available for 0.50-0.80 mm pitch packages.
Electronic Sockets

Socket is available for 0.50-0.80 mm pitch packages.

Suited for applications using BGA, LGA, CSP, and other devices on 0.50 mm or larger pitch, PinBall(TM) Socket can be soldered side-by-side, directly to existing footprint of PC board. Clearances range from 0.5-2.0 mm, depending on pitch. Constructed of FR-4 material, socket features 63/37 tin-lead solderballs on PCB mating side and male spring probe on device mating side, which offers contact...

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Electronic Sockets

IC Socket tests high-speed devices.

Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75,...

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