Relay Sockets accept devices with I/O pins on .100 in. grid.
Relay Sockets

Relay Sockets accept devices with I/O pins on .100 in. grid.

Assembled with precision screw machine receptacles and packaged in high temperature thermoplastic insulators, series 110...10-00X (2-5) relay sockets can be exposed to reflow temperatures. They are available in 4, 6, 8, 14, and 16 pin configurations and use MM#1001 receptacles assembled with hi-rel, 4 finger #30 contact rated at 3 A. Available in RoHS and non-RoHS plating configurations, sockets...

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Socket holds 1,156-pin, 1 mm pitch BGA packages.
Electronic Sockets

Socket holds 1,156-pin, 1 mm pitch BGA packages.

Designed for 35 x 35 mm package size, SG-BGA-6230 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Sockets can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink, and connects all pins with 10 GHz bandwidth on all connections. Socket mounts to target PCB with no soldering and operates in temperatures from -40...

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Electronic Sockets

Socket is designed for use with SiliconDrive II USB Blade.

Vertical SBS Series SiliconBlade(TM) Socket offers USB Blade insertion and extraction while consuming less PCB space. It features high speed Edge Rate(TM) contact system, which is designed for impedance control with reduced broadside coupling. With 40-pin design, socket is capable of hosting array of interfaces offered by Blade, including USB, SD, MMC, SATA, and PCIe, and allows designer to...

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QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
Electronic Sockets

QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.

Mountable on any existing PCB, SG-MLF-7028 is designed for 9 x 9 x 1.6 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Unit features temperature range of -40 to +100°C, pin self inductance of 0.11 nH and mutual inductance...

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Electronic Sockets

BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.

Suited for 27 x 27 mm package size, CG-BGA-4002 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. It can handle up to 100 W with custom heat sink, and has contact resistance of 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features temperature range of -40 to +100°C, pin self-inductance of 0.11 nH, mutual inductance...

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LED Holder facilitates mounting without solder.
Lamp Sockets

LED Holder facilitates mounting without solder.

Consisting of cast aluminum heat sink, plastic locking ring, contact carrier, and tin-plated copper alloy contacts, LED Pixel Holder is available with 2-wire connection for single-color LEDs and 4-wire connection for RGB LEDs. Holder accepts LED board thicknesses from 1.0-2.5 mm, and heat sink fits standard GU10/MR16 light fixtures. Product is rated for up to 2.5 A and 50 Vdc, with operating...

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Transistor Sockets facilitate field insertion and removal.
Electronic Sockets

Transistor Sockets facilitate field insertion and removal.

Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize...

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Comprehensive LED Design Kit Offers Broad Selection of Lighting Technologies
Lamp Sockets

Comprehensive LED Design Kit Offers Broad Selection of Lighting Technologies

PACOIMA, CA (January 6, 2009) - JKL Components Corporation's new LED designer kit GB-LED1 is now available to product development engineers and technicians with the aim of speedy project completion in mind. It includes a full spectrum of LED technologies, and contains a full compliment of LED products appropriate for most design needs. GB-LED1 contains component LEDs, including surface mount and...

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Electronic Sockets

Hybrid Socket provides test or burn-in down to 0.30 mm pitch.

CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...

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Electronic Sockets

Burn-in Sockets are designed for devices up to 6.5 mm2.

Featuring 0.3 mm pitch, Center Probe and CSP/MicroBGA test and burn-in sockets include replaceable interposer sets and require minimal handler tooling for use in CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices for PCBs. Operating from -67 to +302°F, they also include solderless pressure mount compression spring probes, located by 2 molded plastic alignment pins and mounted with 2 SS...

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