Brite Semiconductor Achieves First-Pass Silicon Success with SMIC's 40nm Process
SHANGHAI - Brite Semiconductor (Shanghai) Corporation and Semiconductor Manufacturing International Corporation ( SMIC ; NYSE: SMI; SEHK: 0981.HK) today announced that they have achieved first-pass silicon success with Brite's first 40nm chip, using SMIC's 40nm process technology. Brite Semiconductor's independently designed 40nm chip is the result of Brite's collaboration with Synopsys Inc. and...
Read More »Crocus Introduces Breakthrough Magnetic-Logic-Unit(TM) (MLU) Technology
MLU extends Thermally Assisted Switching(TM) architecture to enable advanced logic and memory functions SUNNYVALE, Calif., -- Crocus Technology, a leading developer of magnetic semiconductors, today announced its Magnetic-Logic-Unit (MLU) architecture, a scalable evolution of Crocus' Thermally Assisted Switching((TM)) (TAS) technology, that permits practical implementation of advanced logic and...
Read More »Broadcom Pioneers Breakthrough in Digital Cable Tuner Design
Introduces Industry's First Fully Digital Full-Band Capture Technology - Fosters Transition to Hybrid IP-based Cable Platforms News Highlights: o To meet consumer demand for TV everywhere and high speed Internet, Broadcom's Full-Band Capture (FBC) enables a more efficient distribution of video streams and IP services to connected devices in the home ecosystem. o FBC enables unprecedented...
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Imec Processes First Power Devices on 200mm CMOS-compatible GaN-on-Si
LEUVEN, BELGIUM - Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. With these wafers, functional GaN MISHEMTs were processed using standard CMOS tools. The used processes are compatible with the strict contamination rules in a standard CMOS processing line (e.g. no use of gold). These first...
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Next-Gen Nanoparticle Arc Shields
This white paper provides an overview into integrating nanoparticles into Paulson face shields.
Read More »LSI CacheCade Technology Now Offered with Dell PowerEdge RAID Controllers
Database performance gains of up to 76 percent enabled by innovative cache tiering solution MILPITAS, Calif., May 17, 2011 - LSI Corporation (NYSE: LSI) today announced that LSI-® CacheCade(TM) technology for application I/O performance acceleration is now available with Dell PowerEdge(TM) RAID Controller (PERC) H700- and H800-family cards. LSI CacheCade technology significantly enhances the I/O...
Read More »MagnaChip to Offer Cost Competitive Copper Wire Bonding
SEOUL, South Korea - MagnaChip Semiconductor Corporation ( MagnaChip Semiconductor ) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers cost competitive and state of the art copper wire bonding technology for the specialized needs of foundry customers. Copper bonding employs copper wires instead of gold for...
Read More »ECG/EEG Analog Front Ends offer on-chip respiration measurement.
By integrating 44 discrete components, 24-bit ADS1298R Series facilitates implementation of respiration detection in portable ECG equipment. Devices provide respiration impedance at resolution of 20 mW, enabling accurate monitoring and correlation of patient respiration to ECG abnormalities. Housed in 8 x 8 mm BGA package with 4, 6, or 8 channels, AFEs use only 750 -µW/channel with multiple...
Read More »Broadcom Completes World's First Microsoft® Mediaroom(TM) Client Integration with New Embedded Wireless High Definition Set-Top Box Solution
Broadcom Delivers Production-Ready, Carrier-Grade Wi-Fi for Whole-Home High Definition Video Distribution IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its Broadcom-® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the Microsoft-® Mediaroom(TM) wireless client...
Read More »Low-Power Semiconductor Technology promotes energy efficiency.
Combining SOI (Silicon-on-Insulator) substrate technology with 0.16 micron lithography, next-generation variation of BCD (Bipolar-CMOS-DMOS) smart power semiconductor technology aims to reduce power consumption of electronic systems. It will enable chip designers to combine high-density logic circuitry (1.8 and 3.3 V CMOS) with full dielectric isolation and component portfolio, including power...
Read More »Wireless Sensors Push Smart Machines into Green Revolution
STMicroelectronics, ARaymond and Micropelt to Demonstrate Thermal-Energy Harvesting Solutions at Hannover Fair - Hall 8, D26 GENEVA, GRENOBLE, France and FREIBURG, Germany - STMicroelectronics (NYSE: STM), ARaymond and Micropelt today announced that they are jointly presenting thermal-energy harvesting-based solutions to power 'smart sensors' and 'smart microsystems' at the Hannover Fair under...
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Neagle Choice, LLC Announces New Available Services
Neagle Choice has long been known as a quality source for commercial sewing, printing, die cutting, and the manufacturing of a wide range of custom products. Enhancing our service capabilities has been the key to our success, and has driven our growth into many new and exciting markets. Continuing on this trajectory, we now offer precision laser cutting and etching, adding to our long line of manufacturing services. See our video to learn all about it.
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