Semiconductor Processing Equipment

Gas Abatement Solution aids in semiconductor processing.
Semiconductor Processing Equipment

Gas Abatement Solution aids in semiconductor processing.

Based on inward-fired combustion technology, HELIOS 6(TM) gas abatement solution has head design with 6 inlets for process gases and one inlet for gas box purges or other ancillary operations. Unit does not require compressed air and can reduce hydrogen concentrations below lower explosive limit (LEL) in flows as high as 200 slm. Applications include high hydrogen flow processes, such as Si and...

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Semiconductor Processing Equipment

Nyden Details a Proactive Role in Designing a New Generation of Large-Scale Integration (LSI) Chips for Optimal Speed, Power and Resolution in All Design Areas of Next-Generation Semiconductor Equipment

For Immediate Release: May 23rd, 2007 Nyden Details a Proactive Role in Designing a New Generation of Large-Scale Integration (LSI) Chips for Optimal Speed, Power and Resolution in All Design Areas of Next-Generation Semiconductor Equipment. High-Performance LSI chips for the Semiconductor Manufacturing and Inspection Technology Industries. San Jose, CA--Nyden Corporation and its parent company,...

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Semiconductor Processing Equipment

Tegal Receives Orders for 900 Series Etchers from Leading Fabs in Japan

Repeat Orders for MEMS and Wireless Device Fabrication SAN JOSE, Calif.--Aug. 25, 2006--Tegal Corporation (Nasdaq:TGAL), a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits and nanotechnology devices, today announced that two leading Japanese companies had placed repeat orders for Tegal 900 series plasma etch systems. Tegal has...

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Semiconductor Processing Equipment

Nova Measuring Instruments Announces Multiple Installations of its NovaScan® 3090-SA Stand Alone Optical CD System

REHOVOTH, Israel, January 29 // -- Nova Measuring Instruments Ltd. (Nasdaq: NVMI), the market leader in integrated measurement and process control for the semiconductor industry, today announced multiple installations of its NovaScan(R) 3090-SA Stand Alone system. The company reported that it has been successful in its initial penetration of the stand alone Optical CD market during 2006, with...

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Semiconductor Processing Equipment

Vicor V·I Chip Components Reduce Energy Costs

Increase Efficiency and Power Density Andover, MA, November 13, 2006...Vicor Corporation (NASDAQ: VICR) today announced the availability of a full family of VÂ-·I Chip(TM) components, enabling complete power systems using Factorized Power Architecture (FPA). FPA separates or 'factorizes' regulation and voltage transformation functions into flexible, high-performance building blocks....

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Semiconductor Processing Equipment

EV Group and Brewer Science Cooperate in the Development of Ultrathin Wafer Handling Solutions for the Microelectronics Industry

EV Group (EVG), based in SchÃ-¤rding, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system. As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and...

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Semiconductor Processing Equipment

BOC Edwards and Aviza Technology Announce Joint Development Agreement for Atomic Layer Deposition

JDA Combines BOC Edwards' Expertise in Chemical Precursor Formulation with Aviza's ALD Hardware Technology to Enhance Utilization, Throughput and Reduce Process Cost WILMINGTON, MASS. and SCOTTS VALLEY, CALIF. (30 October 2006)-BOC Edwards, a leading supplier of technology, equipment and support services to the electronics and microelectronics industries, and Aviza Technology, Inc. (NASDAQ:...

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Semiconductor Processing Equipment

Ultratech Expands Advanced-Packaging Offerings with New Low-Cost Unity Platform(TM)-Based Tools Targeting Foundry Customers

Unity GOLD and Unity PLATINUM Deliver Low-risk, Low-cost, Production-Proven Lithography Solutions SAN JOSE, Calif., Sept. 19 /-- Ultratech, Inc. (NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today introduced two new advanced-packaging (AP) lithography tools built on the company's highly successful Unity...

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Morgan Advanced Ceramics Offers Performance Sic for Semiconductor Processing Equipment
Semiconductor Processing Equipment

Morgan Advanced Ceramics Offers Performance Sic for Semiconductor Processing Equipment

Extending the life of manufacturing equipment, reducing downtime and eliminating contamination Morgan Advanced Ceramics, a leading manufacturer of innovative ceramic, glass, metal and engineered coating solutions, offers Performance Silicon Carbide (SiC) for semiconductor processing equipment manufacturing. Performance SiC is available in two grades, ultrapure and low electrical resistivity....

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