Overlay Metrology System supports multi-patterning techniques.
Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to...
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Overlay Metrology System supports multi-patterning techniques.
Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to...
Read More »IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging
BILLERICA, Mass. - TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now...
Read More »IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging
BILLERICA, Mass. - TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now...
Read More »Converting Services 101: Types of Services, Applications, and How to Select a Provider
This ebook provides an in-depth guide to converting services.
Read More »ReVera Ships a 7th VeraFlex II Production XPS System to Foundries in the Eastern US
Santa Clara, CA - (PRN): Building on its leading position as plan of record for High K - Metal Gate (HKMG) logic process control, ReVera shipped a 7th VeraFlex II(TM) production XPS system to the Eastern US region. The system is the latest repeat order from one of ReVera's foundry customers and will be used for in-line composition and multi-layer thickness control on production wafers. Repeat...
Read More »ReVera Ships a 7th VeraFlex II Production XPS System to Foundries in the Eastern US
Santa Clara, CA - (PRN): Building on its leading position as plan of record for High K - Metal Gate (HKMG) logic process control, ReVera shipped a 7th VeraFlex II(TM) production XPS system to the Eastern US region. The system is the latest repeat order from one of ReVera's foundry customers and will be used for in-line composition and multi-layer thickness control on production wafers. Repeat...
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Wafer Inspection System detects defects on all surfaces.
Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster...
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Wafer Inspection System detects defects on all surfaces.
Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster...
Read More »MEI's Pura(TM) Wet Processing System Achieves Breakthrough for Ultra-Pure Polysilicon for Solar Cells
Company's unique process achieves highest purity polysilicon in any form factor-from granules to chunks - dramatically reducing energy, water, and chemical consumption ALBANY, Ore. - March 26, 2012 - MEI, LLC has made a significant process breakthrough to create ultra-pure electronic-grade polysilicon ideal for manufacturing high efficiency photovoltaic (PV) solar cells and semiconductors. MEI's...
Read More »MEI's Pura(TM) Wet Processing System Achieves Breakthrough for Ultra-Pure Polysilicon for Solar Cells
Company's unique process achieves highest purity polysilicon in any form factor-from granules to chunks - dramatically reducing energy, water, and chemical consumption ALBANY, Ore. - March 26, 2012 - MEI, LLC has made a significant process breakthrough to create ultra-pure electronic-grade polysilicon ideal for manufacturing high efficiency photovoltaic (PV) solar cells and semiconductors. MEI's...
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The Carbontec System: A Smarter Way to Heat Your Buildings
Carbontec's paper-thin radiant heating systems reduce energy consumption costs by warming the building surfaces instead of controlling air temperature. Check out our video to learn more.
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