Electron Beam Metallization System ensures uniformity.
Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping...
Read More »Electron Beam Metallization System ensures uniformity.
Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping...
Read More »Brewer Science Presents New Materials, Processes, and Equipment Innovation at SEMICON China and CSTIC
Brewer Science, the inventor of ARC-® anti-reflective coatings that have enabled the progress of advanced lithography, continues to deliver diverse technology solutions for FEOL and BEOL device fabrication which will be presented at the China Semiconductor Technology International Conference (CSTIC) and at SEMICON China, 19-21 March 2013, in Shanghai, China. Brewer Science will share...
Read More »Brewer Science Presents New Materials, Processes, and Equipment Innovation at SEMICON China and CSTIC
Brewer Science, the inventor of ARCÃ-® anti-reflective coatings that have enabled the progress of advanced lithography, continues to deliver diverse technology solutions for FEOL and BEOL device fabrication which will be presented at the China Semiconductor Technology International Conference (CSTIC) and at SEMICON China, 19-21 March 2013, in Shanghai, China. Brewer Science will share...
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Choosing the Right Type of Chemical Gauge
Understanding the Differences in Chemical Gauges and Their Material Options
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Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative
MII's J-FIL(TM) Technology Accelerating the Semiconductor Industry's Adoption to 450mm Manufacturing by 2 Years AUSTIN, Texas- Molecular Imprints, Inc., a technology leader in advanced semiconductor lithography, today announced the delivery of the first advanced lithography platform capable of patterning 450mm silicon wafer substrates. The Imprio(-®) 450, was accepted by a leading semiconductor...
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Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative
MII's J-FIL(TM) Technology Accelerating the Semiconductor Industry's Adoption to 450mm Manufacturing by 2 Years AUSTIN, Texas- Molecular Imprints, Inc., a technology leader in advanced semiconductor lithography, today announced the delivery of the first advanced lithography platform capable of patterning 450mm silicon wafer substrates. The Imprio(Ã-®) 450, was accepted by a leading...
Read More »Automation Metrology Platform addressses 450 mm requirements.
Customizable to allow for integration of specific wafer staging, metrology modules, optics, wafer alignment mechanisms, and other components, Atlas provides OEMs with- 450 mm metrology automation solution that also handles 300 mm metrology requirements. Industry standard 300/450 mm capable EFEM is used to align and transfer wafers from loadports to inspection station, while airflow and...
Read More »Automation Metrology Platform addressses 450 mm requirements.
Customizable to allow for integration of specific wafer staging, metrology modules, optics, wafer alignment mechanisms, and other components, Atlas provides OEMs withÃ- 450 mm metrology automationÃÂ solution that also handles 300 mm metrology requirements. Industry standard 300/450 mm capable EFEM is used to align and transfer wafers from loadports to inspection station, while airflow...
Read More »Thermal Slide Debonder works with semiconductor substrates.
Offering computerized process control, Cee-® 1300CSX enables high-temperature slide-off of thinned compound semiconductor substrates in R/D or low-volume production environment. Debonder is designed for maximum accuracy and process flexibility and offers several interface capabilities as well as precision lower platen z-position control and programmable electronic lift pins. Additional features...
Read More »Thermal Slide Debonder works with semiconductor substrates.
Offering computerized process control, CeeÃ-® 1300CSX enables high-temperature slide-off of thinned compound semiconductor substrates in R/D or low-volume production environment. Debonder is designed for maximum accuracy and process flexibility and offers several interface capabilities as well as precision lower platen z-position control and programmable electronic lift pins. Additional...
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Complete Water Solutions Offers Wide Range of Water Treatment Equipment
Complete Water Solutions provides full installation tailored to your water treatment needs. Check out the video to learn more.
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