Semiconductor Processing Equipment

Semiconductor Processing Equipment

FSI International Announces the ZETA® Spray Cleaning System with ViPR(TM) Technology is Now Qualified for 200mm Manufacturing

ViPR(TM) technology eliminates ashing for highly implanted photoresist and improves yields for metal stripping following salicide processes MINNEAPOLIS (December 9, 2008) - FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that its FSI ZETA® spray cleaning system with ViPR(TM) technology is now...

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Semiconductor Processing Equipment

MEI LLC Announces New Line of Chemical Delivery Systems for Wet Processing Equipment

Albany, OR. November 5, 2008 -- MEI LLC announces its new line up of four platforms for automated, customized chemical delivery for wet processing systems. Bulk chemical delivery helps eliminate operator pouring, and as a result reduces scrap incidents, spills, water use and waste. The four MEI platforms, DrumChem", "FlexChem", "MultiChem" and "BottleChem", fill a broad range of needs for space...

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Semiconductor Processing Equipment

MEI LLC Announces Major Sales of New "Revolution" Rotary Batch Wafer Processing Systems

Albany, OR. October 31, 2008-MEI LLC announces the sale of four of its newest Revolution" Automated Multi-Step Wet Processing systems. Two single robot systems were sold to a major chemical manufacturer for process development. These systems are designed for 300 mm wafers, and include all Halar construction, internal spiking, and integrated ULPA environments. A stainless steel version of the...

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Wafer Cleaning System uses recipe-driven procedures.
Semiconductor Processing Equipment

Wafer Cleaning System uses recipe-driven procedures.

Suited for 32 and 22 nm technologies, ORION® Single Wafer Cleaning System features closed chamber design for complete control and containment of wafer environment. It addresses issues such as reduction of material loss during photoresist stripping after ultra shallow implants and elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal...

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Semiconductor Processing Equipment

OSRAM Achieves Quantum Leap in Brightness and Efficiency of White LEDs

Santa Clara, CA (July 21, 2008) - By improving all the technologies involved in the manufacture of LEDs, OSRAM development engineers have achieved new records for the brightness and efficiency of white LEDs in the laboratory. Under standard conditions with an operating current of 350 mA, brightness peaked at a value of 155 lm, and efficiency at 136 lm/W. In generating these results, researchers...

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Semiconductor Processing Equipment

Production Mask Aligner suits 3D packaging applications.

Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque...

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Semiconductor Processing Equipment

Tungsten Deposition System targets memory megafabs.

Designed for high-volume tungsten contact fill and interconnect applications, ALTUS® Max(TM) has processing capability to provide tungsten films that meet or exceed 20 nm memory requirements for fill, resistivity, roughness, and defects. It features PNLxT(TM) pulsed nucleation layer process technology, multi-station sequential deposition architecture, and SwiftTrak(TM) wafer handling....

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OSRAM Opto Semiconductors Expands LED Portfolio to Help Lighting Designers and Developers Meet Energy Star® Standards
Semiconductor Processing Equipment

OSRAM Opto Semiconductors Expands LED Portfolio to Help Lighting Designers and Developers Meet Energy Star® Standards

Well Positioned with Golden DRAGON® Plus LED Offering for Solid State Lighting Market Santa Clara, California and Las Vegas, Nevada - (June 4, 2008) - OSRAM Opto Semiconductors, in their ongoing efforts to support energy savings initiatives, continues to broaden their product portfolio to offer LEDs that will help lighting designers and manufacturers meet or exceed ENERGY STAR®...

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Semiconductor Processing Equipment

Semicon West in San Francisco: Bosch Rexroth to Display Applications and Automation Technology to Improve Semiconductor and Photovoltaic Production

Bosch Rexroth Bridge Module Company to feature automation technology and applications that improve productivity, reliability, throughput and cost for semiconductor manufacturing and photovoltaic production, July 15-17 at Semicon West, booths S-841 and S-941. (San Francisco, CA - www.boschrexroth-us.com/SEMICON) Bosch Rexroth, the Drive and Control Company, will exhibit a broad range of automation...

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Semiconductor Processing Equipment

Imprint Lithography Tool meets semiconductor overlay needs.

Leveraging S-FIL® (Step and Flash Imprint Lithography) technology, Imprio® 300 is used for IC prototyping and process development at 32 nm node and beyond. It offers sub-10 nm resolution patterning in single exposure and can create dense, high-resolution structures in 2 dimensions. Drop-in technology - suitable for mix-and-match strategies where resolution advantage can be deployed on...

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