Semiconductor Processing Equipment

Semiconductor Processing Equipment

ReVera Retires the RVX 1000(TM), the Semiconductor Industry's First Production Capable XPS System

Santa Clara, CA - ReVera will discontinue the RVX 1000, effective December 31, 2012. The RVX 1000, ReVera's first product, has been in service for over eight years and was originally developed to qualify transistor gate oxides, such as plasma SiON, and rapidly became the first production metrology tool to measure film composition. The product was also the first production-capable platform to use...

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Mask Alignment System manufactures high-brightness LEDs.
Semiconductor Processing Equipment

Mask Alignment System manufactures high-brightness LEDs.

Equipped with high-intensity UV light source and optional filter fan unit, EVG620HBL Gen II provides wafer throughput up to 165 6-in. wafers/hr. Robotic handling layout with wafer mapping capability supports demand for wafer traceability, while microscope supports automated mask pattern search, minimizing mask setup and change time. With recipe-controlled microscopes, illumination spectrum can be...

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Semiconductor Processing Equipment

Plasma-Therm Receives a Repeat Multi-Module Versaline Order from Wireless Chip Manufacturer

St. Petersburg, FL - Plasma-Therm LLC, a global supplier of plasma process equipment, is pleased to announce the sale of another multi-chamber VERSALINE® production system for etch and deposition to a leading North American wireless compound semiconductor manufacturer. The process modules include an Inductively Coupled Plasma (ICP) etcher for additional capacity for advanced backside GaAs...

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Semiconductor Processing Equipment

Silex Microsystems and A.M. Fitzgerald & Associates Reduce MEMS Development Time by 50%

Multi-Year Collaboration Enables Fast Commercialization of MEMS Designs Through the Silex Sil-Via® Platform JARFALLA, Sweden and BURLINGAME, Calif. - Silex Microsystems, the world's largest pure-play MEMS foundry, and A.M. Fitzgerald & Associates ( AMFitzgerald"), a MEMS product development firm, today announced they have successfully reduced the traditional development time of MEMS devices...

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Semiconductor Processing Equipment

UMC and Synopsys Collaborate to Develop DesignWare IP for 28-Nanometer Technology

Collaboration on Embedded Memory and Logic Library for UMC's Enhanced Poly SiON 28HLP Process Enables Creation of High-Performance, Low-Power SoCs HSINCHU, Taiwan and MOUNTAIN VIEW, Calif. - United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, and Synopsys, Inc., (Nasdaq: SNPS), a world leader in software and IP used in the design,...

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Semiconductor Processing Equipment

Despatch Industries Receives Large Order for Clean Process Ovens from Semiconductor Manufacturer

Minneapolis, Minn., U.S.A. - Despatch Industries, the world's leading thermal processing equipment provider for over one hundred years, announces that the company has received a large order for its LLD inert atmosphere clean process ovens from a long-time customer in the semiconductor industry. The customer will use the ovens to perform stress baking of wafers for its innovative semiconductor...

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Semiconductor Processing Equipment

Wafer Defect Review System is designed for 20 nm node.

Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...

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Semiconductor Processing Equipment

Etch Tool meets process requirements of 22 nm and beyond.

Featuring 2-13.5 MHz switchable RF in addition to 60 MHz RF, Primo AD-RIE(TM) Advanced Decoupled Reactive Ion Etch system has mini-batch cluster architecture that can be configured with up to 3 dual-station process modules, each capable of dual- or- single-wafer processing. Chamber design incorporates plasma confinement and showerhead technology for optimum on-wafer performance. Additional...

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Semiconductor Processing Equipment

Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest

SAN JOSE, Calif. - MonolithIC 3D, Inc., the innovator of practical monolithic 3D IC technology, has unveiled multiple 3D IC technologies that now cover most mainstream semiconductor device types. Besides logic structures, these monolithic 3D technologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabricating image sensors and micro-displays. With...

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Semiconductor Processing Equipment

Wafer Bonding System offers in-line metrology module.

Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing...

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