Semiconductor Processing Equipment

Semiconductor Processing Equipment

Electron Beam Metallization System ensures uniformity.

Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping...

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Semiconductor Processing Equipment

Brewer Science Presents New Materials, Processes, and Equipment Innovation at SEMICON China and CSTIC

Brewer Science, the inventor of ARC® anti-reflective coatings that have enabled the progress of advanced lithography, continues to deliver diverse technology solutions for FEOL and BEOL device fabrication which will be presented at the China Semiconductor Technology International Conference (CSTIC) and at SEMICON China, 19-21 March 2013, in Shanghai, China. Brewer Science will share...

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Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative
Semiconductor Processing Equipment

Molecular Imprints, Inc. (MII) Delivers Industry's First 450mm Advanced Lithography System to a Leading Semiconductor Manufacturer in Support of the Global 450mm Initiative

MII's J-FIL(TM) Technology Accelerating the Semiconductor Industry's Adoption to 450mm Manufacturing by 2 Years AUSTIN, Texas- Molecular Imprints, Inc., a technology leader in advanced semiconductor lithography, today announced the delivery of the first advanced lithography platform capable of patterning 450mm silicon wafer substrates. The Imprio(®) 450, was accepted by a leading...

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Semiconductor Processing Equipment

Automation Metrology Platform addressses 450 mm requirements.

Customizable to allow for integration of specific wafer staging, metrology modules, optics, wafer alignment mechanisms, and other components, Atlas provides OEMs withÂ- 450 mm metrology automation solution that also handles 300 mm metrology requirements. Industry standard 300/450 mm capable EFEM is used to align and transfer wafers from loadports to inspection station, while airflow...

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Semiconductor Processing Equipment

Thermal Slide Debonder works with semiconductor substrates.

Offering computerized process control, Cee® 1300CSX enables high-temperature slide-off of thinned compound semiconductor substrates in R/D or low-volume production environment. Debonder is designed for maximum accuracy and process flexibility and offers several interface capabilities as well as precision lower platen z-position control and programmable electronic lift pins. Additional...

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Overlay Metrology System supports multi-patterning techniques.
Semiconductor Processing Equipment

Overlay Metrology System supports multi-patterning techniques.

Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to...

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Semiconductor Processing Equipment

IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging

BILLERICA, Mass. - TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now...

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Semiconductor Processing Equipment

ReVera Ships a 7th VeraFlex II Production XPS System to Foundries in the Eastern US

Santa Clara, CA - (PRN): Building on its leading position as plan of record for High K - Metal Gate (HKMG) logic process control, ReVera shipped a 7th VeraFlex II(TM) production XPS system to the Eastern US region. The system is the latest repeat order from one of ReVera's foundry customers and will be used for in-line composition and multi-layer thickness control on production wafers. Repeat...

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Wafer Inspection System detects defects on all surfaces.
Semiconductor Processing Equipment

Wafer Inspection System detects defects on all surfaces.

Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster...

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Semiconductor Processing Equipment

MEI's Pura(TM) Wet Processing System Achieves Breakthrough for Ultra-Pure Polysilicon for Solar Cells

Company's unique process achieves highest purity polysilicon in any form factor-from granules to chunks - dramatically reducing energy, water, and chemical consumption ALBANY, Ore. - March 26, 2012 - MEI, LLC has made a significant process breakthrough to create ultra-pure electronic-grade polysilicon ideal for manufacturing high efficiency photovoltaic (PV) solar cells and semiconductors. MEI's...

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Are you in need of safer, more efficient transportation equipment? Do you feel like your delivery equipment could really use an upgrade? Check out this video, and learn about Halo Ramp Company's patented safety platforms, and how they help you bypass your trickiest delivery challenges.

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