Vicor V·I Chip Components Reduce Energy Costs
Increase Efficiency and Power Density Andover, MA, November 13, 2006...Vicor Corporation (NASDAQ: VICR) today announced the availability of a full family of V-·I Chip(TM) components, enabling complete power systems using Factorized Power Architecture (FPA). FPA separates or 'factorizes' regulation and voltage transformation functions into flexible, high-performance building blocks. V·I Chip...
Read More »Vicor V-·I Chip Components Reduce Energy Costs
Increase Efficiency and Power Density Andover, MA, November 13, 2006...Vicor Corporation (NASDAQ: VICR) today announced the availability of a full family of VÃ-·I Chip(TM) components, enabling complete power systems using Factorized Power Architecture (FPA). FPA separates or 'factorizes' regulation and voltage transformation functions into flexible, high-performance building blocks....
Read More »EV Group and Brewer Science Cooperate in the Development of Ultrathin Wafer Handling Solutions for the Microelectronics Industry
EV Group (EVG), based in Schärding, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system. As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and process...
Read More »EV Group and Brewer Science Cooperate in the Development of Ultrathin Wafer Handling Solutions for the Microelectronics Industry
EV Group (EVG), based in SchÃ-¤rding, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system. As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and...
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Specifying Removable Insulation Blankets - A Guide for Engineers
Looking for guidance on how to spec removable insulation? Download our free guide for engineers now!
Read More »BOC Edwards and Aviza Technology Announce Joint Development Agreement for Atomic Layer Deposition
JDA Combines BOC Edwards' Expertise in Chemical Precursor Formulation with Aviza's ALD Hardware Technology to Enhance Utilization, Throughput and Reduce Process Cost WILMINGTON, MASS. and SCOTTS VALLEY, CALIF. (30 October 2006)-BOC Edwards, a leading supplier of technology, equipment and support services to the electronics and microelectronics industries, and Aviza Technology, Inc. (NASDAQ:...
Read More »BOC Edwards and Aviza Technology Announce Joint Development Agreement for Atomic Layer Deposition
JDA Combines BOC Edwards' Expertise in Chemical Precursor Formulation with Aviza's ALD Hardware Technology to Enhance Utilization, Throughput and Reduce Process Cost WILMINGTON, MASS. and SCOTTS VALLEY, CALIF. (30 October 2006)-BOC Edwards, a leading supplier of technology, equipment and support services to the electronics and microelectronics industries, and Aviza Technology, Inc. (NASDAQ:...
Read More »Ultratech Expands Advanced-Packaging Offerings with New Low-Cost Unity Platform(TM)-Based Tools Targeting Foundry Customers
Unity GOLD and Unity PLATINUM Deliver Low-risk, Low-cost, Production-Proven Lithography Solutions SAN JOSE, Calif., Sept. 19 /-- Ultratech, Inc. (NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today introduced two new advanced-packaging (AP) lithography tools built on the company's highly successful Unity...
Read More »Ultratech Expands Advanced-Packaging Offerings with New Low-Cost Unity Platform(TM)-Based Tools Targeting Foundry Customers
Unity GOLD and Unity PLATINUM Deliver Low-risk, Low-cost, Production-Proven Lithography Solutions SAN JOSE, Calif., Sept. 19 /-- Ultratech, Inc. (NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today introduced two new advanced-packaging (AP) lithography tools built on the company's highly successful Unity...
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Morgan Advanced Ceramics Offers Performance Sic for Semiconductor Processing Equipment
Extending the life of manufacturing equipment, reducing downtime and eliminating contamination Morgan Advanced Ceramics, a leading manufacturer of innovative ceramic, glass, metal and engineered coating solutions, offers Performance Silicon Carbide (SiC) for semiconductor processing equipment manufacturing. Performance SiC is available in two grades, ultrapure and low electrical resistivity....
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Morgan Advanced Ceramics Offers Performance Sic for Semiconductor Processing Equipment
Extending the life of manufacturing equipment, reducing downtime and eliminating contamination Morgan Advanced Ceramics, a leading manufacturer of innovative ceramic, glass, metal and engineered coating solutions, offers Performance Silicon Carbide (SiC) for semiconductor processing equipment manufacturing. Performance SiC is available in two grades, ultrapure and low electrical resistivity....
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SpillVak Absorbs Up to 6X More Fluid Than Rock- and Clay-based Absorbents
Are you struggling to find an absorbent that doesn't result in at least some leaching? SpillVak outperforms all rock and clay-based materials. Check out our video to learn more.
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