Production Mask Aligner suits 3D packaging applications.
Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque...
Read More »Production Mask Aligner suits 3D packaging applications.
Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque...
Read More »Tungsten Deposition System targets memory megafabs.
Designed for high-volume tungsten contact fill and interconnect applications, ALTUS-® Max(TM) has processing capability to provide tungsten films that meet or exceed 20 nm memory requirements for fill, resistivity, roughness, and defects. It features PNLxT(TM) pulsed nucleation layer process technology, multi-station sequential deposition architecture, and SwiftTrak(TM) wafer handling. Chamber...
Read More »Tungsten Deposition System targets memory megafabs.
Designed for high-volume tungsten contact fill and interconnect applications, ALTUSÃ-® Max(TM) has processing capability to provide tungsten films that meet or exceed 20 nm memory requirements for fill, resistivity, roughness, and defects. It features PNLxT(TM) pulsed nucleation layer process technology, multi-station sequential deposition architecture, and SwiftTrak(TM) wafer handling....
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Manufacturing 101 for Rubber Molding
Rubber molding is the process of converting uncured rubber into a stable final product.
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OSRAM Opto Semiconductors Expands LED Portfolio to Help Lighting Designers and Developers Meet Energy Star® Standards
Well Positioned with Golden DRAGON-® Plus LED Offering for Solid State Lighting Market Santa Clara, California and Las Vegas, Nevada - (June 4, 2008) - OSRAM Opto Semiconductors, in their ongoing efforts to support energy savings initiatives, continues to broaden their product portfolio to offer LEDs that will help lighting designers and manufacturers meet or exceed ENERGY STAR® standards for...
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OSRAM Opto Semiconductors Expands LED Portfolio to Help Lighting Designers and Developers Meet Energy Star-® Standards
Well Positioned with Golden DRAGONÃ-® Plus LED Offering for Solid State Lighting Market Santa Clara, California and Las Vegas, Nevada - (June 4, 2008) - OSRAM Opto Semiconductors, in their ongoing efforts to support energy savings initiatives, continues to broaden their product portfolio to offer LEDs that will help lighting designers and manufacturers meet or exceed ENERGY STARî...
Read More »Semicon West in San Francisco: Bosch Rexroth to Display Applications and Automation Technology to Improve Semiconductor and Photovoltaic Production
Bosch Rexroth Bridge Module Company to feature automation technology and applications that improve productivity, reliability, throughput and cost for semiconductor manufacturing and photovoltaic production, July 15-17 at Semicon West, booths S-841 and S-941. (San Francisco, CA - www.boschrexroth-us.com/SEMICON) Bosch Rexroth, the Drive and Control Company, will exhibit a broad range of automation...
Read More »Semicon West in San Francisco: Bosch Rexroth to Display Applications and Automation Technology to Improve Semiconductor and Photovoltaic Production
Bosch Rexroth Bridge Module Company to feature automation technology and applications that improve productivity, reliability, throughput and cost for semiconductor manufacturing and photovoltaic production, July 15-17 at Semicon West, booths S-841 and S-941. (San Francisco, CA - www.boschrexroth-us.com/SEMICON) Bosch Rexroth, the Drive and Control Company, will exhibit a broad range of automation...
Read More »Imprint Lithography Tool meets semiconductor overlay needs.
Leveraging S-FIL-® (Step and Flash Imprint Lithography) technology, Imprio® 300 is used for IC prototyping and process development at 32 nm node and beyond. It offers sub-10 nm resolution patterning in single exposure and can create dense, high-resolution structures in 2 dimensions. Drop-in technology - suitable for mix-and-match strategies where resolution advantage can be deployed on...
Read More »Imprint Lithography Tool meets semiconductor overlay needs.
Leveraging S-FILÃ-® (Step and Flash Imprint Lithography) technology, Imprioî 300 is used for IC prototyping and process development at 32 nm node and beyond. It offers sub-10 nm resolution patterning in single exposure and can create dense, high-resolution structures in 2 dimensions. Drop-in technology - suitable for mix-and-match strategies where resolution advantage can be deployed...
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Triad's Next-Gen Power Supplies Offer Increased Reliability and Reduced Noise Performance
Triad Magnetics, an established leader in power supply design and manufacturing, is proud to announce their next generation WAU AC and WDU DC Series of power supplies. These linear wall plug-ins offer minimum noise performance without sacrificing reliability or life. See our video to learn more.
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