Semiconductor Processing Equipment

Semiconductor Processing Equipment

FSI International Announces the ZETA® Spray Cleaning System with ViPR(TM) Technology is Now Qualified for 200mm Manufacturing

ViPR(TM) technology eliminates ashing for highly implanted photoresist and improves yields for metal stripping following salicide processes MINNEAPOLIS (December 9, 2008) - FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that its FSI ZETA-® spray cleaning system with ViPR(TM) technology is now...

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Semiconductor Processing Equipment

FSI International Announces the ZETA-® Spray Cleaning System with ViPR(TM) Technology is Now Qualified for 200mm Manufacturing

ViPR(TM) technology eliminates ashing for highly implanted photoresist and improves yields for metal stripping following salicide processes MINNEAPOLIS (December 9, 2008) - FSI International, Inc. (Nasdaq: FSII), a leading supplier of surface conditioning equipment for microelectronics manufacturing, announced today that its FSI ZETAÂ-® spray cleaning system with ViPR(TM) technology is now...

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Semiconductor Processing Equipment

MEI LLC Announces New Line of Chemical Delivery Systems for Wet Processing Equipment

Albany, OR. November 5, 2008 -- MEI LLC announces its new line up of four platforms for automated, customized chemical delivery for wet processing systems. Bulk chemical delivery helps eliminate operator pouring, and as a result reduces scrap incidents, spills, water use and waste. The four MEI platforms, DrumChem", "FlexChem", "MultiChem" and "BottleChem", fill a broad range of needs for space...

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Semiconductor Processing Equipment

MEI LLC Announces Major Sales of New Revolution" Rotary Batch Wafer Processing Systems

Albany, OR. October 31, 2008-MEI LLC announces the sale of four of its newest Revolution" Automated Multi-Step Wet Processing systems. Two single robot systems were sold to a major chemical manufacturer for process development. These systems are designed for 300 mm wafers, and include all Halar construction, internal spiking, and integrated ULPA environments. A stainless steel version of the...

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Achieving Quality and On-Time Delivery
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Achieving Quality and On-Time Delivery

With decades of experience in machining, COMCO Plastics has developed a reputation for precision in fabricating products to spec. Learn more about our quality standards, and why having those standards in place is so important for a business.

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Semiconductor Processing Equipment

MEI LLC Announces New Line of Chemical Delivery Systems for Wet Processing Equipment

Albany, OR. November 5, 2008 -- MEI LLC announces its new line up of four platforms for automated, customized chemical delivery for wet processing systems. Bulk chemical delivery helps eliminate operator pouring, and as a result reduces scrap incidents, spills, water use and waste. The four MEI platforms, DrumChem", "FlexChem", "MultiChem" and "BottleChem", fill a broad range of needs for space...

Read More »
Semiconductor Processing Equipment

MEI LLC Announces Major Sales of New Revolution" Rotary Batch Wafer Processing Systems

Albany, OR. October 31, 2008-MEI LLC announces the sale of four of its newest Revolution" Automated Multi-Step Wet Processing systems. Two single robot systems were sold to a major chemical manufacturer for process development. These systems are designed for 300 mm wafers, and include all Halar construction, internal spiking, and integrated ULPA environments. A stainless steel version of the...

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Wafer Cleaning System uses recipe-driven procedures.
Semiconductor Processing Equipment

Wafer Cleaning System uses recipe-driven procedures.

Suited for 32 and 22 nm technologies, ORION-® Single Wafer Cleaning System features closed chamber design for complete control and containment of wafer environment. It addresses issues such as reduction of material loss during photoresist stripping after ultra shallow implants and elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal...

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Wafer Cleaning System uses recipe-driven procedures.
Semiconductor Processing Equipment

Wafer Cleaning System uses recipe-driven procedures.

Suited for 32 and 22 nm technologies, ORIONÂ-® Single Wafer Cleaning System features closed chamber design for complete control and containment of wafer environment. It addresses issues such as reduction of material loss during photoresist stripping after ultra shallow implants and elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal...

Read More »
Semiconductor Processing Equipment

OSRAM Achieves Quantum Leap in Brightness and Efficiency of White LEDs

Santa Clara, CA (July 21, 2008) - By improving all the technologies involved in the manufacture of LEDs, OSRAM development engineers have achieved new records for the brightness and efficiency of white LEDs in the laboratory. Under standard conditions with an operating current of 350 mA, brightness peaked at a value of 155 lm, and efficiency at 136 lm/W. In generating these results, researchers...

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Semiconductor Processing Equipment

OSRAM Achieves Quantum Leap in Brightness and Efficiency of White LEDs

Santa Clara, CA (July 21, 2008) - By improving all the technologies involved in the manufacture of LEDs, OSRAM development engineers have achieved new records for the brightness and efficiency of white LEDs in the laboratory. Under standard conditions with an operating current of 350 mA, brightness peaked at a value of 155 lm, and efficiency at 136 lm/W. In generating these results, researchers...

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