New Scribers Products

Laser Wafer Scribers offer frontside/backside capabilities.

All JPSA laser wafer scribing systems support Dual Side Scribe (DSS) processing capability, which lets operators perform frontside and backside scribing for LED, sapphire, GaAs, Si, and metal wafers. Backside camera technology promotes accuracy with accelerated alignment times for DSS systems. In addition to facilitating conversion from frontside to backside scribing, technology supports...

Portable Scribing Machine can attain depths to 0.4 mm.

Applied to part without requiring other pre-tension equipment or supplementary positioning, XF530p can mark pipelines, lifting/hoisting equipment, and off-road vehicles as well as naval constructions and metallic structures. Rigid scribing mechanism supports movements associated with deep scribing, by percussion, to 0.4 mm on flat/angled surfaces or radial curves. Weighing 18 kg, machine has 200...

Marking Tool features diamond tip.

Multi-Scribe(TM) sheet metal marking tool handles various materials and can be used for conventional sheet scribing or dot-matrix marking. Depth of mark can be altered as needed to vary from fine to heavy lines. Tool does not deform material or mark underside of sheets. It is available in thick turret, thin turret, StrippitÃ-®, TrumpfÃ-®, and 114 WiedemannÃ-® styles to accommodate...

Scribing Unit provides deep marking.

Suited for metallic parts, Model SV312 creates continuous line mark at speed of 19 characters, 7 mm tall, in less than 10 sec. Max scribing depth is 0.3 mm in steel at 110 HB and 0.25 mm in cast iron. Marker utilizes UC312 control unit with screen, internal software, and keyboard, eliminating need for PC or PLC. It can create, modify, and store data to mark. Carbide point is available for rough...

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Laser System performs high-speed blue LED wafer scribing.

ChromaDice(TM) UV, diode-pumped, solid-state (DPSS) laser scriber delivers typical yields greater than 99%. System cuts well-defined, square chip with consistently narrow cuts as small as 5 microns. With throughput rating of up to 8 wafers/hr, unit utilizes process that is tolerant of wafer warp and bow. Automatic alignment takes less than 1 min to load and align with system's optical system....

Wafer Scribing System offers alternative to diamond scribing.

AccuScribe-SS20 laser-based sapphire wafer scribing system processes 350 x 350 Ã-µm dies on 50 mm wafers at rate of 40 minutes per wafer. Channel depth is 30 Ã-µm and channel width is 12 Ã-µm. System accommodates blue film expansion frames, performs both full and partial wafer scribing and features automatic edge detection capability. Positive pressure, vacuum venting debris control...

Scribers feature wear-resistant point.

Tungsten-carbide tip scribers are available with or without rare-earth 1 1/2 lb pull magnets. Each has 5 1/2 in. knurled handle with pocket clip. Point reverses for safe storage. Hardened steel points and diamond points are also available. Applications include fine precision marking such as hardened steel, glass, ceramic, hard plastic, or circuit boards.

Laser Scribing System is used for photovoltaic panels.

Laser Scribing System provides beam delivery optics with automatic spot size variability, and multiple independent positioned beams. It features granite based, high speed linear motor/encoder X-Y motion systems, straight to within +/- 0.00075 in. over 8 ft of travel. System offers fully automated material handling for parts up to 3 ft x 6 ft. Process generated debris is removed for high...

Eliminate Expensive Repairs with the Hot-Shot Pipe Thawing Machine

The new Hot Shot Pipe Thawing Machine delivers an innovative and highly effective approach to thawing frozen pipes. Easy to use and versatile, it is loaded with robust features that further suit it to many challenging environments. To learn all about it, see our video.