Resins

Resins

PFA Resin resists cracking in presence of fluoropolymers.

PFA-FLEX series ultra-high purity (UHP) PFA resin suits semiconductor processing applications that require environmental stress crack resistance. It provides chemical and temperature resistance as well as low levels of extractable ions. Flexible PFA-FLEX material is available in two grades: PFA-FLEX X 8502 UHP, with nominal 2 melt-flow index for tubing applications, and PFA-FLEX X 8515 UHP, with...

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Resins

Encapsulating Resin can cure with several agents.

Electronic grade, casting, potting, and encapsulating epoxy resin system No. 20-365140 adheres to metals, ceramics, and plastics. Physical properties include mixed viscosity of 32,500 cps at 25°C, specific gravity from 1.40 to 1.45 at 25°C, and Shore D Hardness rating of 85 to 88. Tensile Strength ranges from 6,100 to 9,200 psi, and operating temp ranges from -40 to +30 and -65 to...

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Epoxy Resin System offers chemical resistance.
Resins

Epoxy Resin System offers chemical resistance.

Two-component EP41S-2 epoxy adhesive/sealant and coating cures at ambient temperatures or more quickly at elevated temperatures. It is 100% reactive and contains no solvents or diluents. EP41S-2 adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics. It withstands prolonged immersion in strong organic solvents. Operating temperature range is -60 to +275°F.

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Epoxy System meets NASA low outgassing specfications.
Resins

Epoxy System meets NASA low outgassing specfications.

EP30-2 low viscosity, two-component system produces high strength bonds that are resistant to thermal cycling and chemicals. Resin system is 100% reactive and does not contain any solvents or other volatiles. Shrinkage upon cure is -0.0003in/in. Hardened resin provides electrical insulation. EP30-2 cures clear and is suitable for sealing, bonding, and laminating applications. Service operating...

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Resins

Adhesive/Sealant bonds and encapsulates.

MNRC 04-1347 UV light curing resin is based on aliphatic urethane acrylate monomer blend. At 1 mil thickness, it cures in 10 to 15 seconds with UV light. Transparent liquid is suitable for clear bonds or encapsulation. It bonds to metal, ceramic, glass, and many plastics. MNRC 04-1347 is thixotropic at 25 deg C, and cures to 40-50 Shore A with elongation of 150%. Operating temperature range is...

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Resins

Adhesive/Sealant bonds most plastics.

MRC 04-1348 UV/Visible light curing adhesive/sealant is based on aliphatic urethane acrylate chemistry. It cures in 2 to 5 seconds with UV light to form bonds that are optically clear and resistant to yellowing, moisture, and some solvents. MRC 04-1348 is semi-thixotropic at 25 deg C, cures to 40 to 50 Shore D, and has operating temperature of -40 to 130 deg C. Transparent liquid is suitable for...

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Resins

Resin Systems offer shore hardness from 30A to 75D.

RTP 2700 U, 2700 S and 2800 B are based on SBS, SEBS, and TPV resin systems, respectively. They permit fabrication of rubber-like articles for applications such as grips, handles, tools, gaskets, seals, hoses, bumpers, strain reliefs, electrical boots, and wheels. Systems can be formulated with properties to increase strength, impart flame retardancy, provide conductivity, and alter appearance...

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Resins

High-Temperature Resins suit critical electronics applications.

Flame-retardant AMODEL FR-4133, FR-6133 and FR-6145 polyphthalamide resins are useful in lead-free SMT soldering operations. They are available in hot-water-moldable base resins, 4000 and 6000, and 2 glass-reinforced levels, 33 and 45%, with heat distortion temperatures up to 300 deg C. Applications include connectors, chip capacitors, cell phone components, circuit breakers, contactors, relays,...

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Epoxy Resin bonds to most materials.
Resins

Epoxy Resin bonds to most materials.

TRA-BOND 2111 thixotropic epoxy resin and hardener formulation is developed for industrial adhesive, staking, laminating, repair, and manufacturing applications where long pot-life, good wetting, non-sag, and non-drip properties are required. Two-part system contains no volatile solvents, and cures at room temperature. It bonds to glass and glass fabrics, ceramics, wood, leather, most metals, and...

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