Repair Compounds

Braz-Print
Repair Compounds

Braz-Print

Braz-Print is a screenable brazing compound (thin paste) available in all standard nickel alloys. Braz-Print is quick drying and cleans easily from screening equipment. The binder in Braz-Print burns off cleanly and will not contaminate vacuum furnaces. Available in 5 lb. Jars. Custom formulations and blending upon request. Vitta Corporation, a leading supplier of brazing materials to the...

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Braz-Print
Repair Compounds

Braz-Print

Braz-Print is a screenable brazing compound (thin paste) available in all standard nickel alloys. Braz-Print is quick drying and cleans easily from screening equipment. The binder in Braz-Print burns off cleanly and will not contaminate vacuum furnaces. Available in 5 lb. Jars. Custom formulations and blending upon request. Vitta Corporation, a leading supplier of brazing materials to the...

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Polymer System cures by UV light and/or heat.
Repair Compounds

Polymer System cures by UV light and/or heat.

HACKENSACK, NJ - Mar 11, 2008 -- Master Bond Inc., Hackensack, N.J. has introduced a new one component, optically clear, non-yellowing UV and/or heat curable polymer system called UV15-7DC. This high performance system is designed for bonding, sealing and coating applications. It is 100% reactive and does not contain any solvents or other volatiles. UV15-7DC is not inhibited by air and exhibits a...

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Polymer System cures by UV light and/or heat.
Repair Compounds

Polymer System cures by UV light and/or heat.

HACKENSACK, NJ - Mar 11, 2008 -- Master Bond Inc., Hackensack, N.J. has introduced a new one component, optically clear, non-yellowing UV and/or heat curable polymer system called UV15-7DC. This high performance system is designed for bonding, sealing and coating applications. It is 100% reactive and does not contain any solvents or other volatiles. UV15-7DC is not inhibited by air and exhibits a...

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Repair Compounds

Underfill Material enables recovery of substrates and PCBs.

Manufactured in lead-free environments, LoctiteÂ-® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing...

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Repair Compounds

Underfill Material enables recovery of substrates and PCBs.

Manufactured in lead-free environments, Loctite-® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing...

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Lab-metal Repair Compounds Solve Patching Problems For Safe Manufacturer
Repair Compounds

Lab-metal Repair Compounds Solve Patching Problems For Safe Manufacturer

When a U.S. safe manufacturer / fabricator recently converted from liquid coating (spray paint) to powder coating, they faced one obstacle: the two-part epoxy based fillers used to cosmetically patch and fill their rough welds and seams failed in the heat of powder coating ovens. After successfully testing Lab-metal and Hi-Temp Lab-metal, one-part metal repair and patching compounds from Alvin...

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Lab-metal Repair Compounds Solve Patching Problems For Safe Manufacturer
Repair Compounds

Lab-metal Repair Compounds Solve Patching Problems For Safe Manufacturer

When a U.S. safe manufacturer / fabricator recently converted from liquid coating (spray paint) to powder coating, they faced one obstacle: the two-part epoxy based fillers used to cosmetically patch and fill their rough welds and seams failed in the heat of powder coating ovens. After successfully testing Lab-metal and Hi-Temp Lab-metal, one-part metal repair and patching compounds from Alvin...

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Repair Compounds

TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.

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Repair Compounds

TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.

Read More »

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