Media Alert: Cadence to Showcase Multi-Purpose, Low-Power DSP at Linley Mobile & Wearables Conference 2016
SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that David Heine, senior design engineering architect, is scheduled to present a paper on multi-purpose, low-power DSPs for mobile and other markets at the Linley Mobile Wearables Conference on July 27, at the Hyatt Regency in Santa Clara, CA. The two-day conference runs July 26-27. WHAT: David Heine is scheduled to...
Read More »FEI Launches Three New Tools for Next-Generation Semiconductor Manufacturing
New solutions are designed to address the challenges of 7nm technology node metrology and defect/failure analysis.- Hillsboro, Ore. - FEI (NASDAQ: FEIC) announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing. Two of the tools are specifically targeted at the 7nm node, and all are designed to allow manufacturers to...
Read More »FEI Launches Three New Tools for Next-Generation Semiconductor Manufacturing
New solutions are designed to address the challenges of 7nm technology node metrology and defect/failure analysis.Ã- Hillsboro, Ore. - FEI (NASDAQ: FEIC) announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing. Two of the tools are specifically targeted at the 7nm node, and all are designed to allow manufacturers...
Read More »Multicore Processors optimize audio system applications.
Using 2 SHARC+ cores and advanced DSP accelerators, ADSP-SC57x/ADSP-2157x Processors deliver greater than 6 giga-floating-point operations/second. Combination of SHARC technology with ARM-® Cortex-A5 system control capability provides solution for complex applications such as Dolby Atmos®, DTS:X®, or active noise cancellation with headroom remaining for further audio post-processing....
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Construction Materials for the Future
In this eBook, we highlight some key advantages of Cross-Laminated Timber (CLT) and show why every builder needs to consider adopting this remarkable construction advancement. We'll also introduce you to the latest innovation in CLT, GRIPBlock™, an exciting new technology that will change the way you look at CLT forever.
Read More »Multicore Processors optimize audio system applications.
Using 2 SHARC+ cores and advanced DSP accelerators, ADSP-SC57x/ADSP-2157x Processors deliver greater than 6 giga-floating-point operations/second. Combination of SHARC technology with ARMÃ-® Cortex-A5 system control capability provides solution for complex applications such as Dolby Atmosî, DTS:Xî, or active noise cancellation with headroom remaining for further audio...
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COM Express Module supports Intel Celeron N3xxx processors.
Allowing OEMs to upgrade products while using existing carrier board, MB-73450 has Type 6 pin-outs and supports dual- and quad-core SoC processors, including Intel-® Celeron® and Pentium® N3000 series (4–10 W), as well as Intel Atom® quad-core x5-E8000 CPUs with turbo-boost frequencies from 2.0–2.56 GHz. Other features include up to 8 GB non-ECC dual-channel DDR3L, support for up...
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COM Express Module supports Intel Celeron N3xxx processors.
Allowing OEMs to upgrade products while using existing carrier board, MB-73450 has Type 6 pin-outs and supports dual- and quad-core SoC processors, including IntelÃ-® Celeronî and Pentiumî N3000àseries (4–10 W), as well as Intel Atomî quad-core x5-E8000 CPUs with turbo-boost frequencies from 2.0–2.56 GHz. Other features include up to 8 GB non-ECC dual-channel...
Read More »Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC
NU4000 multi-purpose SoC brings ultra-low power computer vision capabilities to augmented reality and virtual reality devices, drones, robotics and more MOUNTAIN VIEW, Calif., - May 31, 2016 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Inuitive, a developer of cutting edge depth sensing, computer vision and image...
Read More »Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC
NU4000 multi-purpose SoC brings ultra-low power computer vision capabilities to augmented reality and virtual reality devices, drones, robotics and more MOUNTAIN VIEW, Calif., - May 31, 2016 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Inuitive, a developer of cutting edge depth sensing, computer vision and image...
Read More »Embedded Vision Processors support 1080p to 4K resolutions.
Integrating 1, 2, and 4 vision CPU cores, respectively, DesignWare-® EV61, EV62, and EV64 address high throughput applications such as ADAS, video surveillance, and virtual/augmented reality. Programmable convolution neural network engine, delivering scalable performance to 800 MACs/cycle and supporting image resolutions up to 4K, operates in parallel with CPUs for object detection, image...
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ISO-Certified Plastic Injection Molding from Rodon
The Rodon Group is a proven leader in high-volume, close tolerance injection molding. We offer globally competitive, innovative manufacturing solutions for a broad range of industries. Check out our video to learn more.
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