Xilinx Virtex-5 SXT FPGAs Achieve PCI Express v1.1 Compliance

Proven solution enables users to rapidly adopt industry's fastest 65nm FPGAs with integrated low power endpoint blocks for PCI Express and serial transceivers SAN JOSE, Calif., May 23 / - Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable solutions, today announced that its XtremeDSP(TM) Virtex(TM)-5 SXT FPGAs have passed the latest PCI Express® Endpoint v1.1 base...

Read More »

XO Communications and Jamcracker to Deliver On-Demand Software Services to Small and Medium Businesses

Leading Telecom Carrier Partners with Jamcracker to Offer Web-based Security, Mobility, Collaboration, and Backup & Recovery Software Applications ORLANDO, Fla., May 23 / -- Jamcracker, the on-demand services company, and XO Communications, a leading provider of 21st century communications for businesses and communications carriers, today announced a strategic partnership to deliver on-demand...

Read More »

Multimedia Applications Processor expands design options.

Optimized for mobile consumer and industrial applications, i.MX27 combines Smart Speed(TM) technology, H.264 hardware encoder/decoder, USB, Ethernet, security features, and ARM9(TM) core. Offering video acceleration and applications software in single chip helps increase functionality while reducing power drain and footprint. Able to capture video and play it back in real-time, 32-bit processor...

Read More »

ATCA Processor Blade offers dual 4 Gbps Fiber Channel links.

Suited for telecommunication, IP network media services, and data communication applications, Model aTCA-6892 offers remote setup, and can be configured with FC links at front panel via SFP optical transceivers, or to backplane with Zone 2 connectors, supporting PICMG 3.1 option 4/7 connectivity. Combining dual 64-bit low voltage Intel-® Xeon-® processors with up to 16 GB dual channel PC3200...

Read More »

Freescale and Virtutech Connect to Simplify Multi-Core Development

Freescale and Virtutech connect to simplify multi-core development Now sampling, the dual-core MPC8572 is first of many Freescale devices planned to feature virtualized software development support AUSTIN, Texas, - June 18, 2007 - To address growing demand for technology that simplifies development within increasingly complex multi-core environments, Freescale Semiconductor and Virtutech, Inc....

Read More »

Digital Signal Processor targets Hi-Fi audio applications.

Based on TeakLite family of DSP cores, CEVA-TeakLite-III(TM) delivers 32-bit processing, which includes 32 x 32 MAC unit for support of Dolby Digital Plus 7.1, Dolby TrueHD, and DTS-HD. It also features 4 GB address space for code and data memory, and 10-stage pipeline, enabling core to reach operating speeds of 425 MHz in 65 nm process. Portable audio applications are optimized through dual...

Read More »
Gas Abatement Solution aids in semiconductor processing.

Gas Abatement Solution aids in semiconductor processing.

Based on inward-fired combustion technology, HELIOS 6(TM) gas abatement solution has head design with 6 inlets for process gases and one inlet for gas box purges or other ancillary operations. Unit does not require compressed air and can reduce hydrogen concentrations below lower explosive limit (LEL) in flows as high as 200 slm. Applications include high hydrogen flow processes, such as Si and...

Read More »

BankServ Takes First Customers Live with SwiftNet Phase 2

BUDAPEST, Hungary, May 22 -- Three Hungarian banks have become the first users to go live with a new Phase 2-compliant version of TurboSwift, a banking software system for sending payment messages over the international SWIFT network. The new system, developed by BankServ International in London, is certified for compatibility with SWIFT's Phase 2 standards that went into effect this month in...

Read More »

Nyden Details a Proactive Role in Designing a New Generation of Large-Scale Integration (LSI) Chips for Optimal Speed, Power and Resolution in All Design Areas of Next-Generation Semiconductor Equipment

For Immediate Release: May 23rd, 2007 Nyden Details a Proactive Role in Designing a New Generation of Large-Scale Integration (LSI) Chips for Optimal Speed, Power and Resolution in All Design Areas of Next-Generation Semiconductor Equipment. High-Performance LSI chips for the Semiconductor Manufacturing and Inspection Technology Industries. San Jose, CA--Nyden Corporation and its parent company,...

Read More »

Synthesizable Processors surpass 1 GHz operation.

Featuring advanced microarchitecture for embedded market, MIPS32-® 74K(TM) 32-bit Cores feature 17-stage pipeline that employs combination of out-of-order dispatch and asymmetric dual-issue capability. Out-of-order instruction dispatch enables cores to execute multiple instructions more often than an in-order processor. DSP instructions in Revision 2 of MIPS-® DSP ASE eliminate need for...

Read More »

All Topics