Bell and Howell Announces New Mail Finishing Product Lineup
Solutions and Technologies Aligned to Market Needs Durham, N.C. - Bell and Howell today announced the repositioning and rebranding of its inserting and inveloping product portfolios. The new product series will allow customers to quickly identify solutions that match their needs. While the basic productivity and quality needs of mailers are similar, there are unique requirements that vary across...
Read More »Bell and Howell Announces New Mail Finishing Product Lineup
Solutions and Technologies Aligned to Market Needs Durham, N.C. - Bell and Howell today announced the repositioning and rebranding of its inserting and inveloping product portfolios. The new product series will allow customers to quickly identify solutions that match their needs. While the basic productivity and quality needs of mailers are similar, there are unique requirements that vary across...
Read More »Wafer Defect Review System is designed for 20 nm node.
Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...
Read More »Wafer Defect Review System is designed for 20 nm node.
Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...
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Choosing the Right Material for Your Project
When choosing an appropriate metal material, the range of options is so broad that selecting the correct material for your unique application can be challenging. Different metals have characteristics that can affect weldability, ductility, and formability. Our new eBook outlines the unique properties and applications of popular metals including: Stainless Steel Brass Aluminum Copper Titanium
Read More »EU PVSEC 2011: New Solutions from Montech
(Derendingen) At the European Photovoltaic Solar Energy Exhibition (EU PVSEC) in Hamburg, Montech AG is displaying new solutions to sort and turn over wafers and cells. Among other things, the Swiss company is presenting a new sorting system for wafers and cells, built with Montech's standard components. It's an endless working cycle, without unproductive return track, that optimizes the sorting...
Read More »EU PVSEC 2011: New Solutions from Montech
(Derendingen) At the European Photovoltaic Solar Energy Exhibition (EU PVSEC) in Hamburg, Montech AG is displaying new solutions to sort and turn over wafers and cells. Among other things, the Swiss company is presenting a new sorting system for wafers and cells, built with Montech's standard components. It's an endless working cycle, without unproductive return track, that optimizes the sorting...
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Semiconductor Wafer Bonding System handles 300 and 450 mm sizes.
Designed to support and facilitate industry transition to 450 mm wafers from 300 mm standard, EVG850SOI/450 mm provides fully automated tool for production-level fabrication of silicon-on-insulator (SOI) wafers. System can process both wafer sizes and consists of 2 process modules: one for cleaning and pre-conditioning of wafers before wafer bonding, and for SOI pre-bonding. Tool is equipped with...
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Semiconductor Wafer Bonding System handles 300 and 450 mm sizes.
Designed to support and facilitate industry transition to 450 mm wafers from 300 mm standard, EVG850SOI/450 mm provides fully automated tool for production-level fabrication of silicon-on-insulator (SOI) wafers. System can process both wafer sizes and consists of 2 process modules: one for cleaning and pre-conditioning of wafers before wafer bonding, and for SOI pre-bonding. Tool is equipped with...
Read More »Wafer Bonding Machine produces 3-D ICs at room temperature.
Utilizing Fast Atom Beam gun to irradiate atoms on surface of bonding material, Wafer Bonding Machine enables 3-D integration of LSI circuits on 8 in. wafers at room temperature. FAB gun removes oxide film on surface of bonding metal material that normally impedes bonding. Cassette, capable of housing twenty 8 in. wafers, can perform wafer conveying and alignment for bonding automatically. By...
Read More »Wafer Bonding Machine produces 3-D ICs at room temperature.
Utilizing Fast Atom Beam gun to irradiate atoms on surface of bonding material, Wafer Bonding Machine enables 3-D integration of LSI circuits on 8 in. wafers at room temperature. FAB gun removes oxide film on surface of bonding metal material that normally impedes bonding. Cassette, capable of housing twenty 8 in. wafers, can perform wafer conveying and alignment for bonding automatically. By...
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DoorKing Releases Advanced Long Range Card Reader System with Frequency Hopping Technology
The DoorKing DKS AVI system is at the cutting edge of automotive security technology and represents a leap forward in engineering innovation. When it comes to long-range passive card readers, we lead the industry and set the standard for quality and performance. To find out why the DoorKing DKS AVI system is taking the automotive security industry by storm, see our video.
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