Polyester

DELO and Ticona Jointly Develop Solution for Microelectronics from Special Adhesives and Vectra® LCP

New adhesive holds Vectra-® LCP firmly on the board even after triple reflow process Florence, Ky., Sulzbach, Germany, Shanghai, PR China - Daily use of electronic equipment, like cell phones, laptops or tablet PCs is increasing at a breathtaking pace. At the same time these devices are becoming more powerful and inexpensive from generation to generation while decreasing in size and weight. This...

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Polyester Compound targets LED TV applications.

Developed specifically for LED electronic packaging applications that utilize surface mount technology, Lavanta-® 5115 WH 011- consists of 15% glass fiber-reinforced injection molding compound. Material provides greater than 95% reflectivity with optimized whiteness retention, even after thermal and light aging. Able to fill very thin-walled sections required for low-profile, side-view LEDs,...

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Ticona to Exhibit Polymer Innovations at SAE Commercial Vehicle Congress

Ticona, a leading supplier of engineering polymers, is showcasing material innovations that help to reinvent transportation in Booth # 407 during the SAE 2012 Commercial Vehicle Engineering Congress Oct. 2 to 3 at the Donald E. Stephens Convention Center in Rosemont, Ill. The exhibit will highlight Ticona high-performance engineering polymer and composite technologies that help manufacturers...

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PBT Polyester Resin Shapes withstand high impacts.

Approved for direct contact with food by FDA and other US and European agencies, Hydex-® 4101 and lubricated Hydex-® 4101L stock shapes are suitable for machined parts in food processing equipment. Hydex-® 4101 also offers resistance to typical cleaning chemicals such as chlorine and caustic solutions,- features- absorption rate as- much as 15 times less than nylon, and can withstand high...

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Ticona to Showcase 'Engineering Polymers for Green Electronics' at SEMICON West 2012

Ticona to Showcase 'Engineering Polymers for Green Electronics' at SEMICON West 2012

Ticona is showcasing Engineering Polymers for Green Electronics at SEMICON West 2012, North Hall Booth # 6561, from July 10 to 12 in the Moscone Center, San Francisco. The exhibit will highlight how the portfolio of Engineering Polymers for Green Electronics is helping: -· Micro-electromechanical Systems (MEMS) and Printed/Flexible Electronics industries to employ cost efficient, on large...

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Ticona to Showcase Medical Technology Polymers at Pharmapack® North America

Ticona to Showcase Medical Technology Polymers at Pharmapack® North America

Ticona, a leading global supplier of engineering polymers, is showcasing its broad medical technology (MT-®) portfolio for packaging and advanced drug delivery devices during the Pharmapack-® North America conference and exhibition from May 22 to 23 at the Pennsylvania Convention Center in Philadelphia. Ticona MT polymers are increasingly replacing metals, ceramics and other traditional...

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Ticona Celcon® / Hostaform® POM and Other Brands Now Available for Direct Sale to Customers in Japan

Florence, Ky., Sulzbach, Germany, Shanghai - Ticona Japan, a business of Celanese Corporation, today announced it will sell for the first time in Japan both Celcon-® and Hostaform-® acetal copolymer (POM) along with other Ticona brands of high-performance thermoplastics. Since the move to our new offices in Tokyo is complete, our team is well positioned to sell our complete line of products to...

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Ticona Introduces New High Flow Vectra® LCPs for E/E Applications Demanding Thin Walls, Low Warpage

Florence, Ky., Sulzbach, Germany, Shanghai - Ticona Engineering Polymers has extended its Vectra-® portfolio of halogen free liquid crystal polymers (LCP) to include a new family of high flow, high performance thermoplastics for use in modern electronic portable devices. Ticona polymer scientists developed two new Vectra LCP grades to address the latest trends in E/E requirements to fill the...

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2E Mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring

2E Mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring

15-plus Years MID Technology Experience Florence, Ky., Sulzbach, Germany, Shanghai, PR China - 2E mechatronic GmbH & Co. KG of Germany has designed a 3-D molded interconnect device (MID) flow sensor for air conditioning systems that uses Vectra-® E840i LDS, a liquid crystal polymer (LCP) specially developed by Ticona for electronic circuits on 3-D injection moldings produced with a Laser Direct...

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