Parker Announces Switch to Chromium-6 Free Plating for Metal Products, Resulting in a Technically Superior Plating that is More Environmentally Friendly
WICKLIFFE, Ohio, July 24, 2006 - The Hose Products Division of Parker Hannifin today announced that it will be changing its plating to a process that no longer uses hexavalent chromium (Cr6), a substance that has been deemed environmentally hazardous. In its ongoing efforts to produce more environmentally friendly products and comply with EU restrictions on the use of hexavalent chromium in...
Read More »Flip Chip is designed for wafer bumping applications.
EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...
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How to Select a Thermal Fluid Heater for Your Process
Do you know the important factors you should consider when comparing different types of thermal fluid heaters?
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Dies & Stamping Services with Over 25 Years of Experience
PDS is an established leader in progressive die stamping, with a reputation for providing precision and value that dates back more than half a century. Through extensive capabilities and a staff of seasoned professionals, we set the standard for quality, delivering flexible services that can meet the needs of the most challenging requirements. See our video to learn more.
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