Manual Lead Tinning Station re-tins leads of fine-pitch QFPs. .
Employing side wave solder nozzle that is heavily purged with nitrogen, Manual Lead Tinning Station uses natural cascade of solder to scrub old plating off while wicking away excess solder during extraction of forms leads, leaving leaded array bridge-free. Ergonomically designed workstation can be configured with 1 or 2 solder pots with either side wave or straight immersion nozzles and flowing...
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3D Electroplating System simplifies wafer level packaging.
SABRE 3D electroplating system has modular architecture that delivers processes such as copper through-silicon vias, copper redistribution layers, pillars, under-bump metallization, and lead-free micro-bumping. Enabling multi-layer processing, system includes TurboCell(TM) technology for through-resist plating applications that improves film uniformity and alloy consistency. It also features...
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Lead Tinning System complies with military standards.
Suited for low- to mid-volume in-house re-tinning of electronic components and leads, Anthem Lead Tinning System(TM) is fully ANSI, MIL, IEC, and GEIA compliant. System features 2 dynamic solder pots, pre-heat station, and flux station, as well as precision ball screw drives for quiet motion control. Programming control includes solder temperature; dynamic solder flow; emersion depth...
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Automation System produces cable assemblies.
Built from modular components, TransferModule 6000 includes cable transport system, transfer shuttles, transfer chain, cable loading/unloading stations, control system, and PC-based user interface. Stations can perform stripping, tinning, sealing, shield flaring, and micro-flame soldering, as well as ultrasonic and resistance welding, connector housing insertion, and electrical testing. Typical...
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The Ultimate Guide To UV Disinfection Lighting
This white paper provides a guide to UV disinfection lighting and their benefits over alternative disinfection methods.
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Metallizer System suits PCB repair and re-work applications.
Micro-Metallizer system utilizes disposable marker-type pens based on environmentally friendly plating compounds. System offers bench-top plating convenience, and completely eliminates preparing and handling solutions. Pens can be safely used anywhere. Pens are available in gold, copper, tin, zinc, nickel, black nickel, silver, chrome-color, rhodium, and palladium.
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Chemical Monitoring System employs CVS technique.
Quali-line QLC-6000 provides on-line chemical monitoring for copper electrodeposition process. Automatic system measures organic additives and inorganic components. Cyclic voltammetric stripping (CVS) technique offers logic based features and analysis development. QLC-6000's Microsoft-® Windows-® based platform supports GUI and touch screen monitors.
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Standex Engraving Mold-Tech Offers Nickel Shell Capabilities on a Global Scale
Standex Engraving Mold-Tech is the premier, global supplier for mold texturing and surface finishing. With a full range of services, Standex Engraving Mold-Tech is also the only nickel shell supplier producing in three global locations. See our video to learn more.
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