Major Asian GaAs Foundry Orders Multiple Solstice Electroplating Systems from ClassOne
Kalispell, MT – April 14, 2021 – ClassOne Technology (classone.com), the global provider of advanced semiconductor plating and surface preparation systems, announced that it has received a multi-tool order from one of the largest Gallium Arsenide (GaAs) foundries in Asia. The order was for ClassOne’s Solstice® S8 systems and included proprietary GoldPro™ processing chambers for advanced...
Read More »Major Asian GaAs Foundry Orders Multiple Solstice Electroplating Systems from ClassOne
Kalispell, MT – April 14, 2021 – ClassOne Technology (classone.com), the global provider of advanced semiconductor plating and surface preparation systems, announced that it has received a multi-tool order from one of the largest Gallium Arsenide (GaAs) foundries in Asia. The order was for ClassOne’s Solstice® S8 systems and included proprietary GoldPro™ processing chambers for advanced...
Read More »Hentec/RPS Setting Component Lead Tinning Standards and Compliance
Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities. Newman Lake, WA (March 30, 2021) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that its entire series of Odyssey component lead tinning machines provide full compliance with all...
Read More »Hentec/RPS Setting Component Lead Tinning Standards and Compliance
Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities. Newman Lake, WA (March 30, 2021) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that its entire series of Odyssey component lead tinning machines provide full compliance with all...
Read More »Designing and Specifying the Right Loudspeaker System for Emergency Mass Notification in Public Venues
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Read More »Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne's Solstice Electroplating System
Kalispell, MT – March 24, 2021 – ClassOne Technology, global provider of advanced semiconductor plating tools, announced the sale of a second Solstice® S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY. The eight-chambered Solstice S8 configuration includes ClassOne’s proprietary CopperMax™ chamber...
Read More »Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOneâ™s Solstice Electroplating System
Kalispell, MT – March 24, 2021 – ClassOne Technology, global provider of advanced semiconductor plating tools, announced the sale of a second Solstice® S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY. The eight-chambered Solstice S8 configuration includes ClassOne’s proprietary CopperMax™ chamber...
Read More »Hentec/RPS to Participate in IPC APEX EXPO 2021 Virtual Event
A full range of automated selective soldering machines, component lead tinning machines and solderability test equipment will be on exhibit. Newman Lake, WA (February 16, 2021) – Hentec Industries/RPS Automation is pleased to announce it will exhibit its full range of automated selective soldering machines, component lead tinning machines and solderability test equipment at the upcoming IPC...
Read More »Hentec/RPS to Participate in IPC APEX EXPO 2021 Virtual Event
A full range of automated selective soldering machines, component lead tinning machines and solderability test equipment will be on exhibit. Newman Lake, WA (February 16, 2021) – Hentec Industries/RPS Automation is pleased to announce it will exhibit its full range of automated selective soldering machines, component lead tinning machines and solderability test equipment at the upcoming IPC...
Read More »Circuit Technology Center Installs Second Hentec/RPS Robotic Hot Solder Dip Machine
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities Newman Lake, WA (February 9, 2021) – Hentec Industries/RPS Automation is pleased to announce that Circuit Technology Center has installed its second Hentec/RPS Odyssey 1325 robotic hot solder dip machine. The Odyssey 1325 is a MIL spec complaint high-volume, highmix component lead tinning machine...
Read More »Circuit Technology Center Installs Second Hentec/RPS Robotic Hot Solder Dip Machine
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities Newman Lake, WA (February 9, 2021) – Hentec Industries/RPS Automation is pleased to announce that Circuit Technology Center has installed its second Hentec/RPS Odyssey 1325 robotic hot solder dip machine. The Odyssey 1325 is a MIL spec complaint high-volume, highmix component lead tinning machine...
Read More »Material Handling Solutions from Global Leader in Rubber & Urethane Power Transmission
Megadyne's QST polyurethane timing belts take up less space and guarantee a lower noise level than chain and other traditional material handling belts. Check out our video to learn more.
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