Placement Equipment

Parts Feeders

Die Feeder is optimized for handling small flip chips.

Able to feed variety of bare die and flip chips, DDf Ultra can be mounted on most placement machines. It is capable of feeding die down to 0.5 x 0.5 mm, with throughput exceeding 6,000 die/hr. By combining DDf Ultra with SMT chip shooter, users can create die shooter or flip chip shooter for complete die assembly solution.

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Placement Equipment

Placement Platforms address various assembly tasks.

Platform AC-30L utilizes rotary Lightning head with radial array of 30 modular, individually controlled spindles. It drives placement rates up to 30,000 cph and addresses component range from 0201s to 30 x 30 mm. Multi-Function AX-72 deploys up to 2 heads on one beam, offering combination head capability. Component range is from 0201s to 55 x 55 mm devices at placement rates to 16,500 cph. It...

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SMT Placement System runs multiple jobs without pause.
Placement Equipment

SMT Placement System runs multiple jobs without pause.

Advantage autoplacer, with 324-feeder capacity, is configured so that when first job is finished, feeders for second job are already waiting. System can place entire range of components, from 0201's up to 55 x 55 mm, with speeds up to 21,600 c/hr without need for fine pitch placer or chip shooter. It has modular design that incorporates integration software package.

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Placement Machine delivers high-volume chip placement.
Placement Equipment

Placement Machine delivers high-volume chip placement.

Quadris(TM) hybrid quad-beam SMT chip-placement system, configured with Lightning(TM) heads and turret-style HSP, achieves 62,000 cph placement speed due to integration of dual-drive linear motors. Features include automatic placement-height optimization, Productivity Shift(TM) board transfer system, on-the-fly gang recognition, and bank feeder change and splicing capabilities.

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Placement Machine suits flip chip industry.
Placement Equipment

Placement Machine suits flip chip industry.

Featuring single-beam positioning system, AdVantis(TM) AFC-42 employs dual-drive lead screws as well as 1 Â-µm linear encoders. It includes high-magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, and several feeder types. Up-front configurability and future scalability make machine suited for high-mix and high-volume manufacturers.

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Placement Machine offers placement rates to 54,000 cph.
Placement Equipment

Placement Machine offers placement rates to 54,000 cph.

Platform-based Genesis Lightning features dual heads, each with radial array of 30 modular, individually controlled spindles. Each plug-in spindle module contains tiny venturi vacuum generator to maintain very short vacuum path. Dual on-the-head optics allow machine to address components from 01005 to 30 x 30 mm. Machine supports component preorientation as well as on-the-head rejection for small...

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Placement Machine offers speeds of up to 48,000 cph.
Placement Equipment

Placement Machine offers speeds of up to 48,000 cph.

Model 4797R HSP measures 3,100 x 2,155 mm and can handle boards up to 610 mm x 460 mm. It includes twelve 5-spindle, direct-drive placement heads and UCT53 software for offline programming. Three-sigma accuracy is 0.08 mm for MELFs and small chips, and 0.05 mm for leaded components. Machine accepts up to 72 unique components on standard 8 mm tape feeders, or 96 unique components with dual-track...

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Feeder System suits pick-and-place process.
Parts Feeders

Feeder System suits pick-and-place process.

Triligent Triple Intelligence Feeders, available in tape and stick configurations, maintain uninterrupted high-speed communication with pick-and-place machine. Multiple-LED status indicator and operator signaling display are provided on each unit. Data transmission between Feeder and pick and place system is accomplished via optical interface. Closed-loop servo tape-advance mechanism can be...

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Placement Machine targets small- to mid-size manufacturers.
Placement Equipment

Placement Machine targets small- to mid-size manufacturers.

Vantis(TM) placement platform, for circuit board manufacturing, incorporates single-beam positioning system and supports limited number of heads, cameras, and configurations. Choice of 7-spindle high-speed, or 4-spindle flexible heads accommodates wide component range. Asian language application support, networking capabilities, and intuitive GUI simplify use. Vantis is suitable for manufacturers...

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Placement Equipment

Assembly Station produces to IPC Class 3 specifications.

Expert FPSA-BGA semi-automatic assembly station has 2 heads and 2 vision systems, 1 with glass prism for fine pitch parts and 1 with split vision for ball grid array packages. After alignment has been achieved, automatic mounting of component guarantees exact placements. Reality-based graphics allow operator to double-check placement programming prior to assembly. Program sequence is shown...

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