Bilayer Photoresist handles sub-65nm lithography.
Bilayer photoresist uses silicon polymer in imaging layer to optimize etch selectivity for addressing demands of sub-65nm lithography. Level of silicon content also eliminates need for separate hardmask layer and accompanying process steps. Photoresist exhibits no detectable levels of outgassing during lithography process, and etch selectivity lends to successful transfer of smaller circuit...
Read More »Dry Photoresists provide wafer bumping.
Series WB Photoresists offer alternative for wafer bumping versus liquid resists. Thick, dry photoresists, ranging from 50-100 microns, are applied in one step, with no solvents or drying required. Range of formulations are available for use in lead-free, photostencil, and standard electroplating applications.
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How EDM Controls Ensure Aerospace Validated Processes
Download this white paper to learn more about how wire EDM systems are used to validate aerospace manufacturing processes.
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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.
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