DuPont(TM) Solamet-® Helps REC Increase Solar Panel Power Performance
Collaboration on Materials Continues to Enhance Solar Cell Efficiency RESEARCH TRIANGLE PARK, N.C. –Ã- DuPont™ SolametÃ-® PV18x series photovoltaic metallization paste is helping REC, a leading global provider of solar energy solutions, to develop its most powerful solar panels to date. The achievement is the result of collaboration over the last four years that has focused on...
Read More »Taiyo Showcases Diversified Product Selection at IPC APEX EXPO 2011
Taiyo America will be presenting a wide variety of products at the IPC show this year. With the support of Taiyo Holdings these products will be displayed as static items, graphically and digitally for the best hands on experience possible. The products that will be showcased are Laser Direct Imaging Solder Mask products for flex and rigid, Ink Jet Legend, Dual Cure Type Marking Ink and White...
Read More »Matsushita Electric Industrial Co. Adopts New DuPont(TM) Fodel-® 8G Conductor System
January 29, 2008 Matsushita Electric Industrial Co. Adopts New DuPont(TM) FodelÃ-® 8G Conductor System from DuPont Microcircuit Materials Removing Ruthenium Provides Lower Cost and Improved Image for Plasma Display Panel Manufacturers TOKYO, Japan, Jan. 29, 2008 - DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the adoption of the newest DuPont(TM)...
Read More »DuPont Innovation Builds Flat Panel Displays from the Inside-Out
WILMINGTON, Del., May 22 // -- Spanning a broad range of technologies and products, DuPont (NYSE:DD) today announced its latest offerings to the displays industry, including ground-breaking solutions with significantly improved performance and commercially available products for liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), plasma display panels (PDPs) and field emission...
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The Benefits of Pre-Engineered Systems
Learn more about our pre-engineered thermal fluid system options.
Read More »Adhesive Paste suits stacked die applications.
Designed to meet requirements of semiconductor firms, HysolÃ-® QMI536NB can be used on all levels of stacked die. Non-conductive, PTFE-filled paste exhibits low resin bleed and is lead-free compatible. After multiple exposures to 260Ã-
Read More »Die Attach Material bonds same size die stack packages.
HysolÃ-® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric...
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5 and 13 Micron Resolve Columns with Greater Bed Stability
Jordi Labs provides materials solutions that set the standard for innovation and quality. Our line of GPC and GFC columns are on the cutting edge of precision manufacturing and a result of our uncompromising commitment to quality and customer service. See our video to learn more.
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