Packaging Materials

Vacuum Packaging Services protect IR imaging cameras.

Designed to support customers producing IR imaging cameras, vacuum packaging service offerings include support of low-volume prototypes utilizing packages with ports and high-volume assemblies employing vacuum reflow sealing. All packaging solutions maintain low mTorr levels. Vacuum package design requires analysis of housing and window sealing technologies as well as internal material...

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Boise-® Launches Boise EcoOGR(TM): The Company's First Fluorochemical-Free Oil and Grease Resistant Paper

VANCOUVER, Was., Dec. 4 -- Boise Paper, a division of Boise Cascade, L.L.C., announced today the introduction of fluorochemical-free Boise EcoOGR(TM) flexible packaging papers. Boise is the only paper company focused on manufacturing oil and grease resistant papers entirely without fluorochemicals while meeting the Food and Drug Administration's standards for food packaging. Consumers are...

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Stacked Memory Packaging Technology Takes Mobile Memory Design to New Level

Single Package Can House Eight Memory Chips and One Controller Chip KAWASAKI, Japan, Dec. 11 // -- NEC Electronics, working jointly with Elpida Memory and Oki Electric, has developed novel packaging technology that will allow cell phones and other portable devices to be equipped with as much memory as a high-performance computer. The new technology places eight memory chips and one controller...

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Packaging Films are designed for military use.

Conforming to MIL-DTL-117H as Type II, Class C, Styles 1 or 2 and MIL-PRF-121G, Type 1, opaque MLT1 and clear MLT2 heat-sealable, 9-layer, coextruded films have low moisture vapor transfer rate and oxygen transfer Rate. Both materials are 4 mil thick and support printing and imprinting directly on bag. They are available as Autobag bag-on-a-roll materials and feature sealant layer that...

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Eastman Introduces the Next Generation of PET

New ParaStar resins offer significant performance, economic and environmental benefits to beverage brand owners and converters Chicago, Ill. (October 30, 2006)- Eastman Chemical Company, the world's largest producer of PET for packaging, introduces the next generation of PET resins. Named ParaStar, these innovative resins offer enhanced bottle clarity, product purity, production and supply chain...

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Altera and White Electronic Designs Partner on Specialized Mil/Aero FPGA Packaging

First With Secure, Small Form-Factor Options for Military Applications San Jose, CA and Phoenix, AZ, Nov. 20, 2006-Altera Corporation (NASDAQ: ALTR) and White Electronic Designs Corporation (NASDAQ: WEDC) today announced a partnership that will enable military and aerospace customers access to a broad variety of packaging options for FPGAs that meet the rigorous requirements of defense...

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MARKEM Awarded SAP Interface Certification

PACK EXPO Booth S-2212 KEENE, N.H. (October 26, 2006) - MARKEM Corporation, a trusted world leader in product identification and traceability solutions, announced today that it has been awarded SAPÂ-® interface certification for the CoLOS(TM) Exchange(TM) interface, providing peace of mind for manufacturers who need dependable connections between SAP and the factory floor. The CoLOS Exchange...

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Masterbatch controls fogging in food packaging film.

Meeting food contact regulations, HYDROCLEAR 2 controls formation of water droplets in packaging using films made of oriented polypropylene and cast polypropylene. Cold fog testing on 30 Â-µm multilayer extruded film containing 5% HYDROCLEAR 2 found that anti-fog agent prevents droplet formation within 15 min after package is placed in refrigerator at 4Â-

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Packaging provides wine bottle protection.

Suited for small wine businesses, Winepacks are made from 100% recyclable molded fiber and are available in 1, 2, 3, 4, 6, and 12 stackable bottle configurations. With universal part that serves as top, bottom, and middle insert for 6-bottle configurations, packaging is ISTA-3-A certified for use in UPS and FedEx shipping. One kit consists of 10 winepacks, 10 box inserts, and one shipping...

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Rockwell Automation to Highlight Advantages of Integrated Architecture at PACK EXPO 2006

Global automation supplier will show how its advanced automation solutions help end users boost business performance and help OEMs gain a critical competitive edge MILWAUKEE, Oct. 12, 2006 - At PACK EXPO this year, Rockwell Automation (Booth No. N-4457) will demonstrate how its wide range of integrated control and information systems can provide manufacturers with significant productivity and...

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