Packaging Materials

Packaging Materials

RF Micro Devices® Awarded $1.5 Million Navy Contract for GaN RF Power Technology

R&D Contract Backlog Over Next Six Quarters Increases to $5 Million GREENSBORO, N.C. -- RF Micro Devices (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced today that it has been awarded a $1.5 million R&D contract by the Office of Naval Research (ONR) related to gallium nitride (GaN)...

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Packaging Materials

Peel-Away Packaging System leaves brand messaging and barrier intact.

By allowing packagers to integrate peel-off promotions directly into packages, IntegraPeel(TM) reduces efforts associated with adhesive labels while retaining brand identity and barrier protection. Peel-away packaging system does not have any negative impact on packaging structure and accommodates peelable coupons, recipes, peel/reveal games, and co-branded offers. Design also ensures consistent...

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Laminates

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

ENDICOTT, NY- EI Combines Materials, Fabrication and Test Expertise to Deliver LCP Laminates with Exceptional Performance and Proven Reliability Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless...

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Protective Wrapping System produces material on demand.
Packaging Materials

Protective Wrapping System produces material on demand.

Designed to produce cellular cushioning wrap and air-filled tubes on demand, AirPouch® FastWrap(TM) minimizes storage requirements for bulky rolls of pre-filled protective wrapping material. Portable, benchtop unit produces wrap in 12 in. widths and continuous length with EZ-Tear(TM) perforations every 10 in. Tubes are available in 14 in. lengths and are 1Â-¼ in. dia inflated....

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Individual Coloring for Frame Design Case
Packaging Materials

Individual Coloring for Frame Design Case

Modern design in combination with the right functional properties is an important factor when selecting cases for accommodating PCBs or non standardized electronic components. Exacting demands from purchasers are met by Frame design cases made by Fischer Elektronik, which can be coloured to suit individual requirements. Fischer Elektronik have extended their range of colours for shock-proof...

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Food and Beverage Containers

Baking Management INNOVATION AWARDS (Packaging)

Innovation Awards - Less to ship, more to love A redesigned cookie container packs a big punch by shrinking both its shipping and environmental footprints. With the economy moving sluggishly at best and threatening a double-dip recession at worst, the ecofriendly trend has fallen victim to accounting figures. But what if you could add some green to both your business and your coffers? A new...

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Packaging Materials

IC-Chip Package promotes green manufacturing.

Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...

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Food Trays

Smurfit-Stone's Ensulate® and Meta Tray-8® Featured at PMA Fresh Summit, October 15-18 in Orlando

CREVE COEUR, Mo. and CHICAGO -- Smurfit-Stone Container Corporation, one of the industry's leading containerboard and corrugated packaging producers, will introduce two products that deliver exceptional produce protection at the Produce Marketing Association (PMA) Fresh Summit Expo, October 15-18 at the Orlando County Convention Center. Ensulate® is Smurfit-Stone's new proprietary wax...

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Miscellaneous Manufacturing Services

Electronic Assembly Packaging vertically stacks components.

To meet compact design demands of portable and desktop medical devices, Package on Package (PoP) assembly packaging technology vertically stacks discrete controller and memory Ball Grid Array (BGA) components. This allows multi-chip packages to be integrated for space conservation on PCB and simplifies assembly processes using single flow/reflow, which eliminates thermal stress during assembly....

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Miscellaneous Film

Shiner International Announces Receipt of Patent for Proprietary BOPP Film Technology

HAIKOU, China -- Shiner International, Inc. (NASDAQ:BEST) ("Shiner" or the "Company"), an emerging global supplier of anti-counterfeiting and advanced packaging products, today announced that it has received its sixteenth National Invention Patent covering the product and production process for its proprietary bi-axially oriented polypropylene (BOPP) film with superior-strength heat seal...

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