Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering
ENDICOTT, NY- EI Combines Materials, Fabrication and Test Expertise to Deliver LCP Laminates with Exceptional Performance and Proven Reliability Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless...
Read More »Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering
ENDICOTT, NY- EI Combines Materials, Fabrication and Test Expertise to Deliver LCP Laminates with Exceptional Performance and Proven Reliability Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless...
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Protective Wrapping System produces material on demand.
Designed to produce cellular cushioning wrap and air-filled tubes on demand, AirPouch-® FastWrap(TM) minimizes storage requirements for bulky rolls of pre-filled protective wrapping material. Portable, benchtop unit produces wrap in 12 in. widths and continuous length with EZ-Tear(TM) perforations every 10 in. Tubes are available in 14 in. lengths and are 1¼ in. dia inflated. Operating in...
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Protective Wrapping System produces material on demand.
Designed to produce cellular cushioning wrap and air-filled tubes on demand, AirPouchÃ-® FastWrap(TM) minimizes storage requirements for bulky rolls of pre-filled protective wrapping material. Portable, benchtop unit produces wrap in 12 in. widths and continuous length with EZ-Tear(TM) perforations every 10 in. Tubes are available in 14 in. lengths and are 1ü in. dia inflated....
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PCB Fabrication Notes Guide
The overall purpose of your fabrication notes is to enhance Design for Manufacturability for optimal PCB fabrication and assembly while maintaining applicable industry standards and regulations.
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Individual Coloring for Frame Design Case
Modern design in combination with the right functional properties is an important factor when selecting cases for accommodating PCBs or non standardized electronic components. Exacting demands from purchasers are met by Frame design cases made by Fischer Elektronik, which can be coloured to suit individual requirements. Fischer Elektronik have extended their range of colours for shock-proof...
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Individual Coloring for Frame Design Case
Modern design in combination with the right functional properties is an important factor when selecting cases for accommodating PCBs or non standardized electronic components. Exacting demands from purchasers are met by Frame design cases made by Fischer Elektronik, which can be coloured to suit individual requirements. Fischer Elektronik have extended their range of colours for shock-proof...
Read More »Baking Management INNOVATION AWARDS (Packaging)
Innovation Awards - Less to ship, more to love A redesigned cookie container packs a big punch by shrinking both its shipping and environmental footprints. With the economy moving sluggishly at best and threatening a double-dip recession at worst, the ecofriendly trend has fallen victim to accounting figures. But what if you could add some green to both your business and your coffers? A new...
Read More »Baking Management INNOVATION AWARDS (Packaging)
Innovation Awards - Less to ship, more to love A redesigned cookie container packs a big punch by shrinking both its shipping and environmental footprints. With the economy moving sluggishly at best and threatening a double-dip recession at worst, the ecofriendly trend has fallen victim to accounting figures. But what if you could add some green to both your business and your coffers? A new...
Read More »IC-Chip Package promotes green manufacturing.
Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...
Read More »IC-Chip Package promotes green manufacturing.
Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...
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Krueger Sentry Gauge Announces the Release of Two New Chemical Sight Gauge Models Designed for Aggressive Liquid Storage Monitoring
Krueger Sentry Gauge, a leader in chemical sight gauges, now offers the ultimate in aggressive liquid storage monitoring devices. From sulfuric and hydrochloric acid to bleach, and acetone, our products are designed with robust features that deliver a long and trouble-free service life. See our video to learn all about this new and innovative line of sight gauges.
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