New Motherboard Comes with Gold and Silver Tiers of Pre-Testing Depth
Supports 3rd generation Intel® Xeon® scalable server. Validates server motherboard within server chassis to enable flexible deployments. Tests cover complete functionality, mechanical compatibility, system function testing, and thermal testing .
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Latest Mini-ITX Motherboard Features Two SATA-600 Connectors
Powered by LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 processor with Intel® H310 chipset. Supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 64GB of memory. Equipped with one PCIe x16 and one M.2 Key E slot for wireless devices.
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New Mini-ITX Motherboard Features Dual Intel Gigabit LAN
MI999 supports up to 64GB system RAM and 2666/2933 MHz memory speeds. Designed to accommodate 10th Gen Intel® Core™ processors in LGA 1200 package. Ideal for AIoT industrial automation, intelligent transportation, machine vision and modern smart factories.
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New Mini-ITX Motherboard with V2000 Series Processors Supports up to 64 GB DDR4 SO-DIMM
MI989 Mini-ITX motherboard is equipped with 2x GbE ports, 3x USB 3.1, 2x USB 2.0, 4x COM and 1x SATA III interface. SI-334 digital signage player is powered by V2000 SoC with up to 8 “Zen 2” cores. Offers advanced functionalities such as CEC and hardware EDID emulation and iCONTROL.
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Selecting the Right Materials for Your Metal Stamping Project
Learn about metals and their characteristics to help you choose the right option for your unique application.
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New Mini-ITX Embedded Motherboard Features MOSFET Heatsink
WADE-8212 includes 1x PCI Express x16 and multiple M.2 slots for wireless connectivity. Features dual-channel DDR4 2400/2666/2933 MHz non-ECC SDRAM on two SO-DIMM sockets up to 64 GB. Ideal for industrial automation, robotic manufacturing and automated test equipment applications.
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New MB997 ATX Motherboard Features Dual Intel Gigabit LAN
Includes iSMART 4.0 technology that enables power saving, power on/off and power resumption. Handles up to 128 GB DDR4 memory across four slots. Ideal for industrial automation, AI integrated systems and smart retail systems.
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New EMX-H310P Mini Motherboard Comes with Two 260-pin DDR4 2400/2666MHz SO-DIMM Socket
Powered by Intel® LGA1151 socket that supports 8/9th Gen Intel® Core™ i3/i5/i7, Pentium® and Celeron® SoC processor. Offers PS2 KB/MS + 2 x USB2.0 Type A connector and 2 x USB 2.0 by pin header. Ideal for network devices, NAS server, media center, industrial control systems and other embedded applications.
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New Micro-ATX Motherboard Comes with WISE-DeviceOn Software
Provides high computing power and multiple expansion slots via an Intel® H310 chipset that supports the latest 9th Gen. Intel® Core™ /Pentium®/Celeron® socket-type processors. Features multiple high-speed I/O including 20 x USB ports, 3 x SATA III, PCIe (x16 and x1), 2 x PCI, and a M.2 (B-Key). Equipped with dual Gigabit Ethernet ports that deliver up to 1000 Mbps of bandwidth for...
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New EAX-C246BP Motherboard Comes with Four 288-pin DDR4 2400/2666MHz DIMM Socket
Powered by 8/9th Gen Intel® Core™ i3/i5/i7 and Celeron® SoC Processor. Offered with 1 x DVI-I, 1 x DP++, 1 x DP++, 1 x Intel® i210AT & 1 x Intel® i219LM Gigabit Ethernet, 6 x USB 3.1 Gen2, 4 x USB 3.1 Gen1, 4 x USB 2.0 and 8 x RS-232, 2 x RS-232/422/485, 16-bit GPIO. Ideal for Automation, Industrial, Automatic Medicine Packing Machine and other embedded applications.
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New ATX Industrial Motherboard Supports 1 PCI Express Mini Card Slot
IMB525R offers optimum processor performance, unparalleled flexibility, rich I/O expandability and high graphics performance. Available with two USB 3.1 Gen 2 ports, four USB 3.1 Gen 1 ports and seven 180 D type A USB 2.0 ports for good connection flexibility. Suitable for industrial workstations, embedded networks, factory automation, robotic motion control and machine vision.
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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