Miscellaneous Materials

Die Attach Material bonds same size die stack packages.

HysolÂ-® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric...

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GaN Substrates are offered in 2 in. diameters.

Free-standing gallium nitride (GaN) substrates have uniform dislocation density of 106cm-2 and are available with diameters of 2 in. and smaller. As solid-state blue light emitter, GaN is suited for blue laser diodes, which quadruple data storage on DVDs and print resolution in laser printers, make biomedical laser surgery safer, and double effective range for radar and satellites while...

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Stereolithography Material provides long-term stability.

RenShapeÂ-® SL 7580 offers ABS-like mechanical properties over extended periods of time. It exhibits rigid flexural modulus of 2,400 MPa and retains high elongation, even after aging for several months. Photopolymer produces opaque white parts that look as if they were injection molded from thermoplastic ABS. Formulated for use on solid-state SLA platforms, RenShape SL 7580 features...

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Material System produces plastic prototypes.

Material System produces plastic prototypes.

System zpÂ-®250 includes powder, binder, and Z-Snap(TM) flexible epoxy infiltrant for use with proprietary 3D printers. Prototypes made from system are extremely tough and display flexible properties of plastic, allowing them to be used in variety of functional testing applications. Material is best suited for making parts that will be aggressively handled during testing or assembly process.

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Materials are offered in varying densities for design work.

Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ftÂ-³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284Â-ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ftÂ-³ density and 27 Shore D hardness. Suited for milling foundry patterns and...

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Hardsurfacing Alloy suits high-impact/abrasion applications.

Hardsurfacing Alloy suits high-impact/abrasion applications.

Developed for application with efficient PTA (Plasma Transferred Arc) deposition equipment, Colmonoy 80PTA is supplied as powder with uniform size distribution. Composite material contains high volume (60%) of abrasion resistant tungsten carbide particles (3500 DPH) in soft (HRC 30) impact-resistant nickel base matrix alloy. Tungsten carbide provides abrasion resistance while nickel matrix offers...

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Dielectrics offer low loss characteristics for RF modules.

Dielectrics offer low loss characteristics for RF modules.

MICROLAMÂ-® 610 dielectric minimizes dielectric cracking and provides PCB mechanical reliability. Reinforced microvia material consists of FR-4 epoxy resin and continuous toughening matrix. MICROLAMÂ-® 620 dielectric suits chip package substrates. It consists of thermoset resin in reinforcing matrix with moisture resistance and mechanical reliability. MICROLAMÂ-® 630 dielectric...

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