New Miscellaneous Materials Products

New Glo Brite Logo Points the Way to Increased Visibility for Jessup

MCHENRY, Ill., July 24, 2006 -- Jessup Manufacturing Company recently unveiled a bold new logo for its Glo BriteÃ-® Safety Guidance System. Using photoluminescent technology, the Glo BriteÃ-® system absorbs and stores ambient light that is immediately visible in the event of a blackout or smoke. Glo BriteÃ-® is a non-electric, non-toxic, non-radioactive compound. The new logo is a...

Medical Website provides up-to-date diagnosis information.

Harrison's Practice contains information on diagnosis and treatment for common medical conditions. Accessible via web, wireless, and PDA, tool answers questions at point of medical care. For in-depth information on pathophysiology, users have access to Harrison's Principles of Internal Medicine. Online reference tool includes integrated, detailed information on 51,000+ brand name and generic...

Fujitsu and Tokyo Institute of Technology Announce the Development of New Material for 256Mbit FeRAM Using 65-Nanometer Technology

FeRAMs to Provide Very Low Power, High Speeds for New Mobile Electronic Products SUNNYVALE, Calif., Aug. 2 // -- Fujitsu Microelectronics America, Inc. (FMA) announced that the Tokyo Institute of Technology (Tokyo- Tech), Fujitsu Laboratories Ltd., and Fujitsu Limited have jointly developed a new material for a new generation of non-volatile Ferroelectric Random Access Memory (FeRAM). The...

Pump Material suits continuous high-temperature operation.

AVT butterfly and ball valves are available in abrasion- and corrosion-resistant material, AVT525, which is rated for continuous operation at temperatures to 356Ã-

There's More to Plating than You Zinc!

To find out more about the seven demands you should make of your zinc plater, download now.

Gallium Nitride-on-Diamond-® Wafer has 2 in. diameter.

GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience for high-power, high-frequency electronic, solid-state white lighting,...

Rogers Corp. to Introduce RO4450B(TM)-dx Bondply at IEEE MTT- S

High frequency performance and low cost circuit fabrication Show: IEEE MTT-S (International Microwave Symposium) Dates: June 13 - 15, 2006 Venue: Moscone Convention Center San Francisco, CA Booth #: 1441 Rogers, CT, April 7, 2006: Rogers Corporation (NYSE: ROG) will be introducing its new RO4450B(TM)-dx Bondply, a high fill/flow version of the industry standard RO4450B(TM) High Frequency Circuit...

Semiconductor Wafer addresses classic heat problems.

Available in 10 x 10 mm square pieces, GaN-on-diamond Xero Wafer(TM) consists of gallium nitride layer atomically attached to freestanding, polycrystalline chemical-vapor-deposited diamond substrate measuring 25 microns thick. GaN that is exposed offers atomically smooth surface finish that is epi-ready for further epitaxial deposition. Sub-nanometer proximity of chip's active region to diamond...

Photo-polymer Modeling Material has rubber-like properties.

Designed for Eden333 PolyJet(TM) rapid prototyping systems, FullCure(TM) Tango line provides flexible rubber-like 3D models early in design stage. Line includes TangoBlack(TM), with 61 Shore A hardness, and TangoGray(TM), with 75 Shore A hardness. Both products provide high elongation at break and can stretch to mate with other components. Tango products are suited for prototyping of products...